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LC898111AXB-MH

Onsemi

LC898111AXB-MH by Onsemi

LC898111AXB-MH by Onsemi is a 48-terminal IC with CMOS technology. It operates at 2.6-3.6V and has a package style of GRID ARRAY, suitable for INTERFACE CIRCUIT applications. The IC is surface mountable, with dimensions of 3.22mm x 2.57mm and a terminal pitch of 0.4mm, making it ideal for compact electronic devices.

Median Price

$2.013

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 540,000 parts In-Stock

1+ parts

-

100+ parts

$1.800

1k+ parts

$1.610

10k+ parts

$1.510

540,000

-

$1.800

$1.610

$1.510

DigiKey

USA . 540,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.060

10k+ parts

$2.060

540,000

-

-

$2.060

$2.060

Verical

USA . 508,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.013

10k+ parts

$1.887

508,000

-

-

$2.013

$1.887

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,327 parts In-Stock

1+ parts

$1.881

100+ parts

-

1k+ parts

-

10k+ parts

-

2,327

$1.881

-

-

-

Vyrian

USA . 1,293 parts In-Stock

1+ parts

$1.980

100+ parts

-

1k+ parts

-

10k+ parts

-

1,293

$1.980

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,109 parts In-Stock

1+ parts

$1.782

100+ parts

-

1k+ parts

-

10k+ parts

-

2,109

$1.782

-

-

-

Corohmni

South Africa . 420 parts In-Stock

1+ parts

$1.980

100+ parts

-

1k+ parts

-

10k+ parts

-

420

$1.980

-

-

-

Component Stockers USA

USA . 490,866 parts In-Stock

1+ parts

$2.020

100+ parts

$1.900

1k+ parts

$1.720

10k+ parts

$1.720

490,866

$2.020

$1.900

$1.720

$1.720

Continental Prestige Electronics

USA . 540,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.750

10k+ parts

-

540,000

-

-

$1.750

-

Perfect Parts

USA . 19,992 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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19,992

-

-

-

-

SupplyDigital Components

Austria . 7,736 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,736

-

-

-

-

Problanco Electronics

Mexico . 7,236 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,236

-

-

-

-

Kulean Microsystems

USA . 6,612 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,612

-

-

-

-

A-Z Elektronik GmbH

Germany . 5,972 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,972

-

-

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-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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5,000

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 4,758 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,758

-

-

-

-

Alle Elektronik GmbH

Germany . 3,981 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,981

-

-

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Kepictronics

USA . 3,950 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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3,950

-

-

-

-

GreenTree Electronics

Israel . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,500

-

-

-

-

Metaverse IC Inc.

Canada . 3,450 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,450

-

-

-

-

TANS Electronics

Latvia . 2,403 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,403

-

-

-

-

UHIMA Technologies

Türkiye . 325 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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325

-

-

-

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Microchip USA

USA . 103 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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103

-

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-

-

Overview

Enhance your electronic devices with the LC898111AXB-MH by Onsemi, a top-of-the-line Other Function Interface IC that guarantees quality and performance. Manufactured by Onsemi, a trusted name in the industry, this product offers reliability and innovation for a wide range of applications. With its advanced technology and versatile design, this IC provides customers with unparalleled value and benefits, making it an essential component for any project. Upgrade your systems today with the LC898111AXB-MH and experience the difference in quality and efficiency!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to heat, making the product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort in the manufacturing process.

Maximum Supply Voltage: 3.6 V

Supports a high supply voltage, providing flexibility in various electronic applications.

Package Shape: RECTANGULAR

Rectangular shape offers efficient use of space on the circuit board and allows for easy integration with other components.

No. of Terminals: 48

Multiple terminals enable the product to connect with other devices or components, increasing its versatility.

Minimum Supply Voltage: 2.6 V

Supports a low minimum supply voltage, ensuring compatibility with a wide range of power sources.

Terminal Finish: TIN SILVER COPPER

Tin, silver, and copper terminal finish provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure attachment to the circuit board, improving stability and longevity.

Width: 2.57 mm

Narrow width saves space on the circuit board and facilitates compact design of electronic devices.

Peak Reflow Temperature °C: 260

Can withstand high temperatures during the reflow soldering process, ensuring proper assembly without damage.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage of 3V ensures consistent performance and reliable operation of the product.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed as an interface circuit, making it ideal for connecting different electronic components or systems.

Technical Specifications

Other Function Interface ICs LC898111AXB-MH attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-PBGA-B48

JESD-609 Code:

e1

Length:

3.22 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

48

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.69 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.6 V

Nominal Supply Voltage:

3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

2.6 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.57 mm

Trade Compliance

LC898111AXB-MH Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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