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LC898122AXA-VH

Onsemi

LC898122AXA-VH by Onsemi

LC898122AXA-VH by Onsemi is a 30-terminal IC with CMOS technology. It operates b/w -30 to 85 °C and has a supply voltage range of 2.6V to 3.6V. Ideal for interface circuits, it features a very thin profile, fine pitch grid array package style.

Median Price

$1.795

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 4,900 parts In-Stock

1+ parts

$6.960

100+ parts

$3.430

1k+ parts

$2.260

10k+ parts

-

4,900

$6.960

$3.430

$2.260

-

Rochester

USA . 109,492 parts In-Stock

1+ parts

-

100+ parts

$1.470

1k+ parts

$1.320

10k+ parts

$1.240

109,492

-

$1.470

$1.320

$1.240

DigiKey

USA . 109,492 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.940

10k+ parts

-

109,492

-

-

$1.940

-

Verical

USA . 59,492 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.650

10k+ parts

$1.550

59,492

-

-

$1.650

$1.550

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,756 parts In-Stock

1+ parts

$1.548

100+ parts

-

1k+ parts

-

10k+ parts

-

1,756

$1.548

-

-

-

Vyrian

USA . 1,123 parts In-Stock

1+ parts

$1.630

100+ parts

-

1k+ parts

-

10k+ parts

-

1,123

$1.630

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 639 parts In-Stock

1+ parts

$1.467

100+ parts

-

1k+ parts

-

10k+ parts

-

639

$1.467

-

-

-

Corohmni

South Africa . 356 parts In-Stock

1+ parts

$1.630

100+ parts

-

1k+ parts

-

10k+ parts

-

356

$1.630

-

-

-

Kepictronics

USA . 56,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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56,000

-

-

-

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Perfect Parts

USA . 44,352 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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44,352

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-

-

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Kulean Microsystems

USA . 7,921 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,921

-

-

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A-Z Elektronik GmbH

Germany . 6,891 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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6,891

-

-

-

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Problanco Electronics

Mexico . 5,435 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,435

-

-

-

-

Authorized Procurement Solutions

USA . 4,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,900

-

-

-

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GreenTree Electronics

Israel . 4,900 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,900

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-

-

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Alle Elektronik GmbH

Germany . 4,594 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,594

-

-

-

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Microchip USA

USA . 1,534 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,534

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TANS Electronics

Latvia . 1,088 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,088

-

-

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SupplyDigital Components

Austria . 604 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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604

-

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UHIMA Technologies

Türkiye . 106 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

106

-

-

-

-

Overview

Discover the LC898122AXA-VH by Onsemi, a cutting-edge Interface IC designed to elevate your electronic devices to new heights. Onsemi, known for its commitment to quality and innovation, delivers a product that exceeds expectations. This versatile component is perfect for a wide range of applications, offering seamless integration and unparalleled performance. Unlock the full potential of your electronics with the LC898122AXA-VH, where value meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product suitable for portable devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto PCBs.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of supply voltage options, providing flexibility in design and compatibility with different systems.

Package Shape: RECTANGULAR

Rectangular shape is space-efficient and fits well within compact electronic devices.

No. of Terminals: 30

Having a high number of terminals allows for multiple connections and functionalities within the product.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array with fine pitch design allows for high-density mounting of components, saving space on the PCB.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, making it suitable for use in various environments.

Minimum Operating Temperature: -30 °C

Capable of operating at low temperatures, making it suitable for use in harsh conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish offers good conductivity and corrosion resistance, ensuring reliable connections.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure connection to the PCB.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency of the product.

Nominal Supply Voltage: 3 V

Nominal supply voltage is within standard range for many electronic devices, ensuring compatibility with common power sources.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for high-density mounting and precise connections, contributing to overall reliability.

Interface IC Type: INTERFACE CIRCUIT

Interface circuit IC type enables seamless communication between different components in a system, enhancing overall functionality.

Technical Specifications

Other Function Interface ICs LC898122AXA-VH attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Additional Features:

IT ALSO OPERATES AT 3V

Interface IC Type:

JESD-30 Code:

R-PBGA-B30

JESD-609 Code:

e1

Length:

2.59 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

30

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.45 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.6 V

Nominal Supply Voltage:

3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

2.6 V

Nominal Supply Voltage-1:

2.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.99 mm

Trade Compliance

LC898122AXA-VH Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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