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LC75863E-E

Onsemi

LC75863E-E by Onsemi

LC75863E-E by Onsemi is a graphics display driver with 75 segments, CMOS technology, and serial data input mode. It operates in industrial temperature range (-40 to 85 °C) and has a max supply voltage of 6V. Ideal for liquid crystal display applications due to its segment display mode and quad terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,152 parts In-Stock

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Digiode

USA . 920 parts In-Stock

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920

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Distributors (Availability)

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AZTECH Wire

Italy . 417 parts In-Stock

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$10.300

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417

$10.300

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QUARKTWIN TECHNOLOGY LTD

USA . 25,156 parts In-Stock

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Problanco Electronics

Mexico . 6,234 parts In-Stock

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Kulean Microsystems

USA . 5,140 parts In-Stock

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TANS Electronics

Latvia . 2,872 parts In-Stock

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Corphita

USA . 2,449 parts In-Stock

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SupplyDigital Components

Austria . 1,339 parts In-Stock

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UHIMA Technologies

Türkiye . 758 parts In-Stock

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Corohmni

South Africa . 410 parts In-Stock

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Microchip USA

USA . 405 parts In-Stock

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Overview

Revolutionize your display applications with the LC75863E-E by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in all their products. The LC75863E-E is a game-changer in the Graphics Display Drivers category, offering unparalleled value and benefits to customers. With its advanced features and cutting-edge technology, this product is a must-have for any project requiring precision and efficiency. Upgrade your displays today with the LC75863E-E and experience the difference for yourself!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material ensures long-term reliability and ease of handling.

Display Mode: SEGMENT

Segment display provides clear and precise information, making it ideal for applications requiring detailed visual feedback.

Data Input Mode: SERIAL

Serial data input mode allows for easy and efficient communication with other devices, enhancing overall system performance.

Surface Mount: YES

Surface mount capability enables easy integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 6 V

High maximum supply voltage allows for compatibility with a wide range of power sources, increasing versatility.

Package Shape: SQUARE

Square package shape facilitates uniform mounting and handling, ensuring proper installation.

No. of Terminals: 48

Sufficient number of terminals for connecting to other components, enabling seamless integration within the system.

Package Style (Meter): FLATPACK

Flatpack package style offers space-saving benefits and easy installation, ideal for compact designs.

Minimum Supply Voltage: 4.5 V

Low minimum supply voltage ensures efficient power usage and compatibility with various power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in challenging environments, enhancing product durability.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures operational reliability even in harsh conditions, making it suitable for industrial applications.

Terminal Finish: TIN BISMUTH

Tin bismuth terminal finish provides excellent solderability and reliability, ensuring secure connections.

Terminal Position: QUAD

Quad terminal position allows for easy alignment and soldering during installation, simplifying the assembly process.

Width: 14 mm

Compact width dimensions save space and make the product suitable for compact designs.

Maximum Time At Peak Reflow Temperature (s): 30

Optimal time at peak reflow temperature ensures proper soldering and component integrity during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature facilitates efficient soldering, ensuring strong and reliable connections.

Length: 14 mm

Compact length dimensions save space and make the product suitable for compact designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh environmental conditions, making it suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, enhancing overall efficiency.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage ensures compatibility with common power sources, simplifying integration.

No. of Segments: 75

Large number of segments provide detailed display capabilities, ideal for applications requiring complex visuals.

Terminal Pitch: 1 mm

Narrow terminal pitch allows for compact design and easy soldering, enhancing overall product performance.

Moisture Sensitivity Level (MSL): 4

Moisture sensitivity level 4 ensures reliable performance in humid environments, enhancing product durability.

Interface IC Type: LIQUID CRYSTAL DISPLAY DRIVER

Liquid crystal display driver interface offers seamless communication with display panels, ensuring accurate and reliable visual output.

Technical Specifications

Graphics Display Drivers LC75863E-E attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Data Input Mode:

SERIAL

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e6

Length:

14 mm

Moisture Sensitivity Level (MSL):

4

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

75

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Maximum Seated Height:

3 mm

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

6 V

Minimum Supply Voltage-1:

4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

LC75863E-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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