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LC75841PES-H

Onsemi

LC75841PES-H by Onsemi

LC75841PES-H by Onsemi is a graphics display driver with 54 segments, operating at -40 to 105 °C. It features a serial data input mode, open-drain output polarity, and low profile flatpack package style. Ideal for industrial LCD applications requiring a supply voltage of 4-6V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,596 parts In-Stock

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Digiode

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475

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AZTECH Wire

Italy . 682 parts In-Stock

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$17.390

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Kulean Microsystems

USA . 8,054 parts In-Stock

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TANS Electronics

Latvia . 4,517 parts In-Stock

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SupplyDigital Components

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Problanco Electronics

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Authorized Procurement Solutions

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Perfect Parts

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Kepictronics

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UHIMA Technologies

Türkiye . 364 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 134 parts In-Stock

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Corphita

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Overview

Elevate your display experience with the LC75841PES-H by Onsemi, a top-quality graphics display driver designed to deliver exceptional performance and reliability. As a trusted manufacturer in the industry, Onsemi ensures that this product meets the highest standards, offering customers peace of mind and confidence in their purchase. Ideal for various applications requiring segment display modes and serial data input, this driver provides seamless integration and efficient operation. Unlock the potential of your displays with the LC75841PES-H and enjoy unparalleled value, benefits, and advantages that enhance your overall user experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for applications where weight and durability are important factors.

Display Mode: SEGMENT

The segment display mode allows for clear and concise information display, making it suitable for applications where readability is key.

Data Input Mode: SERIAL

The serial data input mode provides efficient and reliable data transmission, ensuring accurate display of information.

Surface Mount: YES

The surface mount capability simplifies the manufacturing process and reduces the overall size of the product, making it easier to integrate into compact designs.

Maximum Supply Voltage: 6 V

The high maximum supply voltage allows for flexibility in power supply options, accommodating a range of different voltage sources.

Package Shape: SQUARE

The square package shape provides a uniform and neat appearance, making it easy to stack multiple units together for larger display configurations.

Power Supplies (V): 5

The 5V power supply is a commonly used voltage level in electronics, ensuring compatibility with a wide range of systems.

No. of Terminals: 36

The 36 terminals provide ample connectivity options for interfacing with other components, allowing for versatile usage in various applications.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack, low profile package style saves space and allows for easy placement in slim devices or tight spaces.

No. of Backplanes: 2-BP

The presence of 2 backplanes enhances the display performance and stability, ensuring a reliable and consistent output.

Minimum Supply Voltage: 4 V

The low minimum supply voltage requirement ensures efficient power usage and extends the product's operating range to accommodate lower voltage sources.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature tolerance allows the product to operate reliably in harsh environmental conditions without overheating or performance degradation.

Output Characteristics: OPEN-DRAIN

The open-drain output characteristics facilitate easy interfacing with other components and devices, enhancing compatibility and overall system flexibility.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature rating ensures the product can function effectively in cold environments, expanding its usability in various applications.

Terminal Finish: TIN BISMUTH

The use of tin bismuth as the terminal finish material provides good solderability and long-term reliability, ensuring robust connections for consistent performance.

Terminal Position: QUAD

The quad terminal position layout enhances the product's connectivity options and facilitates easy integration into circuit designs, offering greater flexibility for custom applications.

Maximum Seated Height: 1.7 mm

The low maximum seated height contributes to a compact and sleek design, making the product suitable for slim devices or space-constrained installations.

Width: 7 mm

The 7mm width dimension allows for efficient use of space and enables the product to be easily integrated into various devices and equipment with limited space availability.

Output Polarity: TRUE

The true output polarity ensures accurate and reliable signal transmission, preventing signal errors or misinterpretations for consistent display performance.

Maximum Time At Peak Reflow Temperature (s): 30

The specified maximum time at peak reflow temperature guarantees proper soldering and thermal management during manufacturing processes, ensuring product quality and reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for robust soldering connections and ensures the product can withstand the heat stress of reflow soldering processes without damage.

Length: 7 mm

The 7mm length dimension contributes to a compact and space-efficient design, enabling the product to be easily incorporated into various applications without occupying excessive space.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating indicates the product's suitability for operation in industrial environments with extended temperature ranges, ensuring reliable performance under challenging conditions.

Technology: CMOS

The CMOS technology used in the product offers low power consumption, high noise immunity, and fast switching speeds, contributing to efficient and reliable operation in demanding applications.

Terminal Form: GULL WING

The gull wing terminal form factor provides mechanical strength and solder joint reliability, ensuring durable connections and long-term performance stability in various operating conditions.

Maximum Supply Current: 3.2 mA

The low maximum supply current requirement helps in conserving power and prolonging battery life in battery-operated devices, making the product energy-efficient.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is a widely used standard in electronics, ensuring easy compatibility and integration with existing systems and power sources.

No. of Segments: 54

The presence of 54 segments allows for versatile and detailed display configurations, offering flexibility in presenting information and graphics for various applications.

Terminal Pitch: 0.635 mm

The 0.635mm terminal pitch provides precise and secure connections, facilitating reliable data transmission and ensuring stable performance in demanding operational conditions.

Minimum fmax: 0.0304 MHz

The minimum fmax value of 0.0304 MHz ensures high-speed data processing and response, enabling quick and efficient display updates for real-time information presentation.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates the product's resistance to moisture and humidity, ensuring long-term reliability and performance even in challenging environmental conditions.

Interface IC Type: LIQUID CRYSTAL DISPLAY DRIVER

The interface IC type being a liquid crystal display driver ensures compatibility with various LCD panels, enabling seamless integration and operation in display systems requiring driver support.

Technical Specifications

Graphics Display Drivers LC75841PES-H attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Data Input Mode:

SERIAL

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

S-PQFP-G36

JESD-609 Code:

e6

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

Multiplexed Display Capability:

NO

No. of Backplanes:

2-BP

No. of Functions:

1

No. of Segments:

54

No. of Terminals:

36

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP36,.35SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Sub-Category:

Other Interface ICs

Maximum Supply Current:

3.2 mA

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Minimum fmax:

.0304 MHz

Trade Compliance

LC75841PES-H Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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