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LC75832E-E

Onsemi

LC75832E-E by Onsemi

LC75832E-E by Onsemi is a Graphics Display Driver with 108 segments, operating at -40 to 105 °C. It has a serial data input mode, 64 terminals, and supports segment display mode. Ideal for industrial applications requiring liquid crystal display drivers in compact spaces.

Median Price

$1.350

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 600 parts In-Stock

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$1.350

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600

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$1.350

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Flip Electronics (Authorized)

USA . 600 parts In-Stock

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600

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Vyrian

USA . 3,885 parts In-Stock

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3,885

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Flip Electronics

USA . 600 parts In-Stock

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600

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Digiode

USA . 471 parts In-Stock

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471

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Distributors (Availability)

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Corohmni

South Africa . 462 parts In-Stock

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$1.470

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462

$1.470

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Kulean Microsystems

USA . 6,820 parts In-Stock

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TANS Electronics

Latvia . 6,383 parts In-Stock

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Problanco Electronics

Mexico . 6,151 parts In-Stock

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SupplyDigital Components

Austria . 2,834 parts In-Stock

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Microchip USA

USA . 2,085 parts In-Stock

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Corphita

USA . 1,576 parts In-Stock

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UHIMA Technologies

Türkiye . 68 parts In-Stock

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Overview

Unlock the potential of your display with the LC75832E-E by Onsemi, a high-quality graphics display driver that offers unparalleled performance and reliability. With Onsemi's reputation for excellence in manufacturing, you can trust that this product is built to last. Ideal for applications requiring SEGMENT display mode and SERIAL data input mode, this driver provides seamless integration and exceptional clarity. Experience the value of smooth operation, easy installation, and precise control, making it the perfect choice for your next project. Elevate your displays with the LC75832E-E and see the difference for yourself.

Feature Benefit Bullets

Display Mode: SEGMENT

Segment display allows for individual control of each segment of the display, providing flexibility in designing and displaying information.

Data Input Mode: SERIAL

Serial data input mode simplifies the communication process, making it easier to integrate this display driver into a system.

Maximum Supply Voltage: 6V

The high maximum supply voltage of 6V ensures compatibility with a wide range of systems and power sources.

Package Shape: SQUARE

The square package shape allows for efficient use of space and easy integration into a variety of applications.

Power Supplies (V): 3/5

Multiple power supply options (3V or 5V) provide flexibility in powering the display driver based on system requirements.

No. of Terminals: 64

The 64 terminals allow for versatile connectivity options, enabling the display driver to interface with various components.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105 °C ensures reliable performance even in harsh environments.

Technology: CMOS

The CMOS technology used in this display driver offers low power consumption, high noise immunity, and compatibility with a wide range of devices.

Technical Specifications

Graphics Display Drivers LC75832E-E attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Data Input Mode:

SERIAL

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

S-XQFP-G64

JESD-609 Code:

e6

Length:

14 mm

Moisture Sensitivity Level (MSL):

4

Multiplexed Display Capability:

NO

No. of Backplanes:

2-BP

No. of Functions:

1

No. of Segments:

108

No. of Terminals:

64

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

QFP64,.66SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

6 V

Minimum Supply Voltage-1:

2.7 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

LC75832E-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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