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LC75829PEH-H

Onsemi

LC75829PEH-H by Onsemi

LC75829PEH-H by Onsemi is a graphics display driver with 208 segments, CMOS technology, and 600 MHz min fmax. It operates in industrial temperature range (-40 to 85 °C) and has a max supply voltage of 6 V. Ideal for liquid crystal display driver applications due to its serial data input mode and segment display mode.

Median Price

$2.410

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 60 parts In-Stock

1+ parts

-

100+ parts

$2.410

1k+ parts

$2.160

10k+ parts

$2.030

60

-

$2.410

$2.160

$2.030

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,586 parts In-Stock

1+ parts

$2.546

100+ parts

-

1k+ parts

-

10k+ parts

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1,586

$2.546

-

-

-

Vyrian

USA . 2,789 parts In-Stock

1+ parts

-

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2,789

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Distributors (Availability)

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Corphita

USA . 844 parts In-Stock

1+ parts

$2.412

100+ parts

-

1k+ parts

-

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844

$2.412

-

-

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Corohmni

South Africa . 292 parts In-Stock

1+ parts

$2.680

100+ parts

-

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292

$2.680

-

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AZTECH Wire

Italy . 431 parts In-Stock

1+ parts

$8.440

100+ parts

-

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431

$8.440

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 24,506 parts In-Stock

1+ parts

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24,506

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TANS Electronics

Latvia . 7,919 parts In-Stock

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7,919

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SupplyDigital Components

Austria . 7,864 parts In-Stock

1+ parts

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7,864

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Kulean Microsystems

USA . 7,091 parts In-Stock

1+ parts

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7,091

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Problanco Electronics

Mexico . 3,224 parts In-Stock

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3,224

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Microchip USA

USA . 398 parts In-Stock

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398

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UHIMA Technologies

Türkiye . 31 parts In-Stock

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31

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Overview

Elevate your display with the LC75829PEH-H from Onsemi, a leading manufacturer of high-quality Graphics Display Drivers. This versatile product offers seamless serial data input mode and segment display mode, making it perfect for a wide range of applications. With a maximum supply voltage of 6V and industrial-grade temperature tolerance, this driver provides reliability and durability. Experience crisp visuals and smooth operation while maximizing efficiency, all in a compact and easy-to-install package. Upgrade your display capabilities with the LC75829PEH-H and see the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the graphics display driver, ensuring longevity and reliability.

Display Mode: SEGMENT

SEGMENT display mode allows for clear and concise information display, making it ideal for applications where segmented viewing is required.

Data Input Mode: SERIAL

SERIAL data input mode offers efficient communication and control, enhancing the performance and responsiveness of the graphics display driver.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this graphics display driver can withstand extreme cold environments, ensuring reliable operation in harsh conditions.

Technology: CMOS

CMOS technology ensures low power consumption and high performance, making this graphics display driver energy-efficient and reliable for long-term use.

Technical Specifications

Graphics Display Drivers LC75829PEH-H attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Data Input Mode:

SERIAL

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e6

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Backplanes:

4-BP

No. of Functions:

1

No. of Segments:

208

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.66SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/6

Qualification:

Not Qualified

Maximum Seated Height:

3 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

4.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Minimum fmax:

600 MHz

Trade Compliance

LC75829PEH-H Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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