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LC75818PT-8560-H

Onsemi

LC75818PT-8560-H by Onsemi

LC75818PT-8560-H by Onsemi is a Graphics Display Driver with DOT MATRIX display mode and SERIAL data input. It operates at 2.7-3.6V, has 120 terminals, and supports 16-DIGIT characters. Ideal for industrial applications requiring a compact FLATPACK package with GULL WING terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,786 parts In-Stock

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Digiode

USA . 1,792 parts In-Stock

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1,792

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Distributors (Availability)

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AZTECH Wire

Italy . 803 parts In-Stock

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$20.710

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803

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QUARKTWIN TECHNOLOGY LTD

USA . 16,136 parts In-Stock

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Problanco Electronics

Mexico . 4,496 parts In-Stock

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SupplyDigital Components

Austria . 3,903 parts In-Stock

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3,903

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TANS Electronics

Latvia . 2,320 parts In-Stock

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Corphita

USA . 990 parts In-Stock

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990

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UHIMA Technologies

Türkiye . 877 parts In-Stock

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Kulean Microsystems

USA . 639 parts In-Stock

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Corohmni

South Africa . 314 parts In-Stock

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Microchip USA

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Overview

Enhance your display designs with the LC75818PT-8560-H by Onsemi, a top-tier manufacturer known for delivering high-quality graphics display drivers. Perfect for applications requiring dot matrix displays, this product offers a seamless serial data input mode and operates within a wide temperature range. With a compact flatpack package style and a thin profile, this driver is easy to integrate into your projects. Trust Onsemi's expertise in the field of interface IC technology and elevate your products with the reliable performance and efficiency of the LC75818PT-8560-H.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Display Mode: DOT MATRIX

Dot matrix display provides clear and crisp visuals, ensuring better readability and visual appeal.

Data Input Mode: SERIAL

Serial data input mode offers efficient data transfer and communication between the display driver and other components.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with various systems.

Package Shape: SQUARE

The square package shape helps in easy mounting and integration into electronic devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the display driver can withstand harsh environmental conditions and ensure stable performance.

Terminal Finish: TIN BISMUTH

Tin bismuth terminal finish provides good solderability and reliability, enhancing the longevity of the product.

No. of Digits/Characters: 16-DIGIT

The display driver supports up to 16 digits/characters, allowing for versatile display options and information presentation.

Technical Specifications

Graphics Display Drivers LC75818PT-8560-H attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Data Input Mode:

SERIAL

Display Mode:

DOT MATRIX

Interface IC Type:

JESD-30 Code:

S-PQFP-G120

JESD-609 Code:

e6

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

Multiplexed Display Capability:

NO

No. of Backplanes:

10-BP

No. of Digits/Characters:

16-DIGIT

No. of Functions:

1

No. of Segments:

80

No. of Terminals:

120

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP120,.64SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Interface ICs

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

LC75818PT-8560-H Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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