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LC75100M

Onsemi

LC75100M by Onsemi

The Onsemi LC75100M is a CMOS consumer circuit IC with 36 terminals in a small outline package. It operates b/w -20 °C to 70°C, with supply voltage ranging from 8V to 10V. Ideal for various consumer electronic applications due to its compact size and surface-mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,223 parts In-Stock

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Vyrian

USA . 1,509 parts In-Stock

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1,509

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Distributors (Availability)

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Kulean Microsystems

USA . 7,327 parts In-Stock

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7,327

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Problanco Electronics

Mexico . 3,354 parts In-Stock

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3,354

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Corphita

USA . 2,422 parts In-Stock

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2,422

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SupplyDigital Components

Austria . 1,180 parts In-Stock

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1,180

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UHIMA Technologies

Türkiye . 447 parts In-Stock

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447

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TANS Electronics

Latvia . 402 parts In-Stock

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402

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Corohmni

South Africa . 399 parts In-Stock

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Overview

Elevate your consumer electronic designs with the LC75100M by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality products that meet the highest standards. The LC75100M is a versatile consumer circuit IC that offers exceptional value and benefits to customers. With its small outline package shape and dual terminal position, this IC is perfect for a variety of applications. Experience the advantages of reliability and performance with the LC75100M – take your projects to the next level today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability for the product, making it suitable for various consumer electronic applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost during manufacturing.

Package Shape: RECTANGULAR

Rectangular package shape ensures compatibility with standard PCB layouts, making integration into existing systems seamless.

No. of Terminals: 36

The ample number of terminals allows for versatile connectivity options, enabling the product to interface with multiple external components.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the energy efficiency and reliability of the product.

Technical Specifications

Other Function Consumer ICs LC75100M attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G36

Length:

15.2 mm

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Maximum Seated Height:

2.45 mm

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Width:

7.9 mm

Trade Compliance

LC75100M General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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