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LC75106V-TLM-H

Onsemi

LC75106V-TLM-H by Onsemi

LC75106V-TLM-H by Onsemi is a CMOS IC with 36 terminals, operating from -20 to 70 °C. It has a power supply of 9V and is surface mountable in a small outline package. Ideal for consumer electronics applications requiring high reliability and compact design.

Median Price

$6.475

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1,692 parts In-Stock

1+ parts

$11.200

100+ parts

$5.910

1k+ parts

$4.400

10k+ parts

-

1,692

$11.200

$5.910

$4.400

-

Rochester

USA . 62 parts In-Stock

1+ parts

-

100+ parts

$1.750

1k+ parts

$1.560

10k+ parts

$1.470

62

-

$1.750

$1.560

$1.470

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,682 parts In-Stock

1+ parts

$1.938

100+ parts

-

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1,682

$1.938

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-

-

Chip Stock

USA . 41,000 parts In-Stock

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41,000

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-

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Vyrian

USA . 6,357 parts In-Stock

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6,357

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Flip Electronics

USA . 1,700 parts In-Stock

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1,700

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,906 parts In-Stock

1+ parts

$1.836

100+ parts

-

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-

10k+ parts

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1,906

$1.836

-

-

-

Corohmni

South Africa . 244 parts In-Stock

1+ parts

$2.040

100+ parts

-

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244

$2.040

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-

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Component Stockers USA

USA . 79 parts In-Stock

1+ parts

$2.090

100+ parts

-

1k+ parts

-

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79

$2.090

-

-

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AZTECH Wire

Italy . 436 parts In-Stock

1+ parts

$22.000

100+ parts

-

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436

$22.000

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Perfect Parts

USA . 11,444 parts In-Stock

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11,444

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TANS Electronics

Latvia . 8,299 parts In-Stock

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8,299

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Microchip USA

USA . 4,616 parts In-Stock

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4,616

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SupplyDigital Components

Austria . 4,429 parts In-Stock

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4,429

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GreenTree Electronics

Israel . 4,000 parts In-Stock

1+ parts

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4,000

-

-

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Problanco Electronics

Mexico . 3,092 parts In-Stock

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3,092

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Kulean Microsystems

USA . 2,238 parts In-Stock

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2,238

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Kepictronics

USA . 1,978 parts In-Stock

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1,978

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Authorized Procurement Solutions

USA . 1,692 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,692

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Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

-

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1,000

-

-

-

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UHIMA Technologies

Türkiye . 723 parts In-Stock

1+ parts

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723

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Futuretech Components

Singapore . 602 parts In-Stock

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602

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Overview

Unlock the potential of your consumer electronics with the LC75106V-TLM-H by Onsemi. Known for their superior quality and reliability, Onsemi delivers cutting-edge technology in every product. This versatile IC is perfect for a wide range of applications, offering unmatched performance and efficiency. With a power supply of 9V and a compact package style, this product ensures seamless integration and ease of use. Elevate your projects with the innovative features and benefits of the LC75106V-TLM-H, a game-changer in the world of consumer ICs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness, making the product reliable and affordable.

Surface Mount: YES

Surface mount technology makes for easier and more efficient assembly of electronic devices, saving time and reducing errors.

Power Supplies (V): 9

Having a power supply of 9V allows for compatibility with a wide range of other electronic components and devices.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures that the product can withstand various environmental conditions without malfunctioning.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable in operation.

Technical Specifications

Other Function Consumer ICs LC75106V-TLM-H attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

36

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP36,.3,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

9

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Trade Compliance

LC75106V-TLM-H General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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