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LC75106V

Onsemi

LC75106V by Onsemi

The Onsemi LC75106V is a consumer IC with 36 terminals in a small outline package. It operates b/w -20 °C to 70°C, with supply voltage ranging from 8V to 10V. This CMOS technology chip is ideal for various consumer circuit applications due to its compact size and surface-mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,353 parts In-Stock

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Digiode

USA . 450 parts In-Stock

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450

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Problanco Electronics

Mexico . 5,742 parts In-Stock

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Kulean Microsystems

USA . 5,257 parts In-Stock

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SupplyDigital Components

Austria . 4,301 parts In-Stock

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Corphita

USA . 1,441 parts In-Stock

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TANS Electronics

Latvia . 916 parts In-Stock

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Corohmni

South Africa . 467 parts In-Stock

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UHIMA Technologies

Türkiye . 185 parts In-Stock

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Overview

Discover the LC75106V by Onsemi, a cutting-edge consumer IC that promises top-notch quality and reliability. With Onsemi's renowned reputation for innovation and excellence, this product is guaranteed to exceed your expectations. Ideal for a wide range of applications in the consumer electronics industry, the LC75106V offers unmatched value and benefits to customers looking for high-performance solutions. Experience seamless integration, versatility, and efficiency like never before with this state-of-the-art IC. Elevate your projects with the LC75106V and unlock a world of endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for consumer electronics.

Surface Mount: YES

Being surface mountable means easy and efficient installation on circuit boards, saving space and enabling automated assembly.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on the circuit board and improves overall design aesthetics.

General IC Type: CONSUMER CIRCUIT

Specifically designed for consumer applications, ensuring compatibility and optimal performance in various electronic devices.

No. of Terminals: 36

A high number of terminals allow for versatile connection options, enhancing the functionality of the IC.

Package Style: SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

This compact package style saves space on the board, reduces overall height, and improves thermal performance.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even under harsh environmental conditions.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature allows the IC to function effectively in cold environments.

Terminal Position: DUAL

Dual terminal positions provide flexibility in installation and connection, accommodating various circuit board layouts.

Maximum Seated Height: 1.7 mm

The low seated height enables a slim and compact design, suitable for space-constrained applications.

Width: 5.6 mm

The narrow width facilitates efficient placement on the circuit board, optimizing layout and saving precious board space.

Minimum Supply Voltage (Vsup): 8 V

The low minimum supply voltage requirement allows the IC to operate with a wide range of power sources, enhancing versatility.

Length: 15 mm

The compact length of the IC contributes to space-saving design and easy integration into various electronic devices.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital circuits.

Terminal Form: GULL WING

The gull wing terminal form provides secure soldering connections and facilitates automated assembly processes.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high-density mounting on the circuit board, maximizing input/output connections.

Maximum Supply Voltage (Vsup): 10 V

The high maximum supply voltage ensures stable operation and protection against voltage fluctuations, increasing reliability.

Technical Specifications

Other Function Consumer ICs LC75106V attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G36

Length:

15 mm

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Maximum Seated Height:

1.7 mm

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Width:

5.6 mm

Trade Compliance

LC75106V General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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