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LC75700T-TLM-E

Onsemi

LC75700T-TLM-E by Onsemi

CONSUMER CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: TIN BISMUTH; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e6;

Median Price

$1.264

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 21,877 parts In-Stock

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-

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$1.240

1k+ parts

$1.030

10k+ parts

$0.918

21,877

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$1.240

$1.030

$0.918

Verical

USA . 21,877 parts In-Stock

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$1.288

10k+ parts

$1.147

21,877

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$1.288

$1.147

Distributors (In-Stock)

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Digiode

USA . 1,974 parts In-Stock

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$0.969

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$0.969

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Vyrian

USA . 7,203 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 658 parts In-Stock

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658

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Bristol Electronics

USA . 658 parts In-Stock

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658

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Dan-Mar Components

USA . 658 parts In-Stock

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658

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Distributors (Availability)

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Corphita

USA . 2,028 parts In-Stock

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$0.918

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$0.918

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Corohmni

South Africa . 491 parts In-Stock

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$1.020

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491

$1.020

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AZTECH Wire

Italy . 991 parts In-Stock

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$17.280

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991

$17.280

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A-Z Elektronik GmbH

Germany . 5,048 parts In-Stock

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SupplyDigital Components

Austria . 4,658 parts In-Stock

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TANS Electronics

Latvia . 4,497 parts In-Stock

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Kepictronics

USA . 4,000 parts In-Stock

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Problanco Electronics

Mexico . 3,525 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,365 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Kulean Microsystems

USA . 1,537 parts In-Stock

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1,537

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UHIMA Technologies

Türkiye . 841 parts In-Stock

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841

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Microchip USA

USA . 430 parts In-Stock

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430

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Technical Specifications

Other Function Consumer ICs LC75700T-TLM-E attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Terminal Finish:

TIN BISMUTH

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LC75700T-TLM-E General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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