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LC75700T

Onsemi

LC75700T by Onsemi

LC75700T by Onsemi is a small outline, thin profile IC with 20 terminals. Operating temperature ranges from -40 to 85 °C. It is a CMOS consumer circuit suitable for industrial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,064 parts In-Stock

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Digiode

USA . 692 parts In-Stock

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692

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TANS Electronics

Latvia . 5,031 parts In-Stock

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SupplyDigital Components

Austria . 4,845 parts In-Stock

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Problanco Electronics

Mexico . 2,794 parts In-Stock

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Corphita

USA . 1,394 parts In-Stock

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Corohmni

South Africa . 434 parts In-Stock

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Kulean Microsystems

USA . 395 parts In-Stock

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UHIMA Technologies

Türkiye . 163 parts In-Stock

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Overview

Enhance your consumer electronic devices with the LC75700T by Onsemi. This high-quality IC offers a wide range of applications in the consumer circuit category, providing superior performance and reliability. With a compact design and industrial-grade temperature range, this product delivers exceptional value and benefits to customers. Trust in Onsemi's expertise and innovation to elevate your products to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/epoxy package body material helps to protect the internal circuitry from external elements and provides durability to the IC.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly process.

Package Shape: RECTANGULAR

Rectangular package shape is a standard and versatile design that fits well on various types of circuit boards.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures allows this IC to be used in both extreme cold and hot conditions.

Terminal Position: DUAL

Dual terminal position provides better stability and reliability in circuit connections.

Width: 4.4 mm

Compact width of 4.4mm saves space on the circuit board and allows for higher density of components.

Minimum Supply Voltage (Vsup): 2.7 V

Low minimum supply voltage requirement enables energy-efficient operation and extends battery life in portable devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability and performance in harsh industrial environments.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and noise immunity for efficient operation.

Technical Specifications

Other Function Consumer ICs LC75700T attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

LC75700T General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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