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LB1868M-TLM-H

Onsemi

LB1868M-TLM-H by Onsemi

LB1868M-TLM-H by Onsemi is a Motion Control IC with 14 terminals, operating voltage of 6.4-7V, and output current up to 1A. Ideal for Brushless DC Motor Controllers, it has a compact rectangular package suitable for surface mount applications at temperatures ranging from -30 to 80 °C.

Median Price

$0.728

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 681 parts In-Stock

1+ parts

-

100+ parts

$0.728

1k+ parts

$0.604

10k+ parts

$0.539

681

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$0.728

$0.604

$0.539

Distributors (In-Stock)

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Digiode

USA . 1,133 parts In-Stock

1+ parts

$0.594

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1,133

$0.594

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Vyrian

USA . 7,787 parts In-Stock

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7,787

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Distributors (Availability)

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Corphita

USA . 989 parts In-Stock

1+ parts

$0.562

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989

$0.562

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Corohmni

South Africa . 208 parts In-Stock

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$0.625

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208

$0.625

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AZTECH Wire

Italy . 354 parts In-Stock

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$13.890

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354

$13.890

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Kepictronics

USA . 26,000 parts In-Stock

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26,000

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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25,000

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Problanco Electronics

Mexico . 8,189 parts In-Stock

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Kulean Microsystems

USA . 8,029 parts In-Stock

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8,029

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TANS Electronics

Latvia . 3,976 parts In-Stock

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SupplyDigital Components

Austria . 1,872 parts In-Stock

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UHIMA Technologies

Türkiye . 418 parts In-Stock

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418

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Microchip USA

USA . 412 parts In-Stock

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Overview

Discover the LB1868M-TLM-H by Onsemi, a top-of-the-line Motion Control IC that guarantees precision and reliability. Crafted by the renowned manufacturer Onsemi, this product excels in delivering superior performance and efficiency. Ideal for applications such as brushless DC motor control, this IC offers unparalleled value with its compact design and wide operating temperature range. Elevate your projects with the LB1868M-TLM-H and experience seamless motion control like never before!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring the product can withstand various environmental conditions.

Nominal Supply Voltage (Vsup): 6.7 V

The operating voltage of 6.7 V ensures compatibility with common power sources, making integration easier for different applications.

Maximum Operating Temperature: 80 °C

With a maximum operating temperature of 80 °C, this product can operate efficiently even in high-temperature environments, enhancing its reliability.

Maximum Output Current: 1 A

The high maximum output current of 1 A allows the product to drive motors with higher power requirements, making it suitable for a wide range of applications.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that this product can withstand exposure to moderate levels of moisture during handling and storage.

Technical Specifications

Motion Control ICs LB1868M-TLM-H attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e6

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-30 Cel

Maximum Output Current:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP14,.25,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

12,24

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

50 mA

Maximum Supply Voltage (Vsup):

7 V

Minimum Supply Voltage (Vsup):

6.4 V

Nominal Supply Voltage (Vsup):

6.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

LB1868M-TLM-H Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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