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LB1868M-MPB-H

Onsemi

LB1868M-MPB-H by Onsemi

LB1868M-MPB-H by Onsemi is a Motion Control IC with 12-24V power supplies. It has 14 terminals, operates b/w -30 to 80 °C, and supports surface mount installation. Ideal for applications requiring small outline packages and Gull Wing terminals in commercial extended temperature environments.

Median Price

$0.818

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 504 parts In-Stock

1+ parts

-

100+ parts

$0.727

1k+ parts

$0.603

10k+ parts

$0.538

504

-

$0.727

$0.603

$0.538

DigiKey

USA . 504 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.910

10k+ parts

-

504

-

-

$0.910

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 517 parts In-Stock

1+ parts

$0.566

100+ parts

-

1k+ parts

-

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517

$0.566

-

-

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Vyrian

USA . 10,474 parts In-Stock

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10,474

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,295 parts In-Stock

1+ parts

$0.536

100+ parts

-

1k+ parts

-

10k+ parts

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2,295

$0.536

-

-

-

Corohmni

South Africa . 94 parts In-Stock

1+ parts

$0.596

100+ parts

-

1k+ parts

-

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94

$0.596

-

-

-

Problanco Electronics

Mexico . 4,699 parts In-Stock

1+ parts

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4,699

-

-

-

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Kulean Microsystems

USA . 4,546 parts In-Stock

1+ parts

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4,546

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TANS Electronics

Latvia . 3,706 parts In-Stock

1+ parts

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3,706

-

-

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SupplyDigital Components

Austria . 959 parts In-Stock

1+ parts

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959

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UHIMA Technologies

Türkiye . 430 parts In-Stock

1+ parts

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430

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Microchip USA

USA . 369 parts In-Stock

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369

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Overview

Enhance your motion control systems with the LB1868M-MPB-H by Onsemi. Known for their top-notch quality and reliability, Onsemi delivers cutting-edge solutions for a wide range of applications. This compact yet powerful IC offers customers unparalleled value, performance, and efficiency. Say goodbye to limitations and hello to seamless motion control with the LB1868M-MPB-H. Elevate your projects and experience the difference with Onsemi's innovative technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the internal components of the Motion Control ICs.

Surface Mount: YES

Being surface mount compatible allows for easy and efficient installation of the Motion Control ICs on circuit boards, saving time and effort.

Power Supplies (V): 12,24

Compatibility with power supplies of 12V and 24V offers flexibility in various application scenarios, making the product versatile.

No. of Terminals: 14

With 14 terminals, this Motion Control ICs product can support multiple connections and functions, enabling complex control systems.

Maximum Operating Temperature: 80 °C

The high maximum operating temperature of 80 °C ensures reliable performance even in demanding environmental conditions.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature of -30 °C expands the range of operating environments where the Motion Control ICs can function effectively.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C indicates the product's ability to withstand manufacturing processes involving high temperatures without damage.

Maximum Supply Current (Isup): 50 mA

The maximum supply current of 50 mA indicates the efficiency of the Motion Control ICs in managing power consumption and reducing energy wastage.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this product is less susceptible to moisture-related damage, ensuring long-term reliability in humid environments.

Technical Specifications

Motion Control ICs LB1868M-MPB-H attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

14

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP14,.25,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

12,24

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

50 mA

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LB1868M-MPB-H Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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