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LB1668M-MPB-H

Onsemi

LB1668M-MPB-H by Onsemi

LB1668M-MPB-H by Onsemi is a Motion Control IC with 14 terminals, operating at -30 to 80 °C. It has a supply voltage of 6.7V and max current of 50mA. Ideal for applications requiring bipolar technology in commercial extended temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 10,953 parts In-Stock

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Digiode

USA . 1,122 parts In-Stock

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AZTECH Wire

Italy . 439 parts In-Stock

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$10.400

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439

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TANS Electronics

Latvia . 6,528 parts In-Stock

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Kulean Microsystems

USA . 5,400 parts In-Stock

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SupplyDigital Components

Austria . 5,309 parts In-Stock

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Problanco Electronics

Mexico . 1,686 parts In-Stock

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Corphita

USA . 1,672 parts In-Stock

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UHIMA Technologies

Türkiye . 370 parts In-Stock

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Microchip USA

USA . 346 parts In-Stock

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Corohmni

South Africa . 111 parts In-Stock

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Overview

Experience superior motion control with the LB1668M-MPB-H by Onsemi. As a leader in the industry, Onsemi ensures top-notch quality and reliability in their products. The LB1668M-MPB-H falls under the category of Motion Control ICs, making it versatile for a wide range of applications. Customers can expect excellent value and benefits from this product, such as precise control and efficiency in managing motion. Upgrade your systems with the LB1668M-MPB-H and witness enhanced performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package durable and resistant to environmental factors, ensuring the longevity of the product.

Surface Mount: YES

The surface mount feature allows for easy integration into circuit boards, saving space and simplifying the manufacturing process.

Nominal Supply Voltage (Vsup): 6.7 V

The 6.7V nominal supply voltage ensures compatibility with various systems and provides a stable power source for the device.

Maximum Operating Temperature: 80 °C

With a maximum operating temperature of 80 °C, this product can perform reliably in challenging environments without overheating.

Technology: BIPOLAR

The use of bipolar technology offers precise control and efficient operation, making this product suitable for advanced motion control applications.

Technical Specifications

Motion Control ICs LB1668M-MPB-H attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

14

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP14,.25,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

6.7

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

50 mA

Nominal Supply Voltage (Vsup):

6.7 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LB1668M-MPB-H Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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