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DRV8876NRGTR

Texas Instruments

DRV8876NRGTR by Texas Instruments

DRV8876NRGTR by Texas Instruments is a Motion Control IC with 16 terminals, operating voltage range of 4.5V to 37V, and max output current of 3.5A. This BRUSH DC MOTOR CONTROLLER is designed for automotive applications, featuring a compact square package shape and wide temperature range from -40°C to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,829 parts In-Stock

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Vyrian

USA . 1,624 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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300

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One Stop Electronics

USA . 462 parts In-Stock

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$0.500

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$0.500

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Ampacity Inc.

Singapore . 1,129 parts In-Stock

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$1.500

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Semicontronic

India . 827 parts In-Stock

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$6.500

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$6.338

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$6.305

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827

$6.500

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Corohmni

South Africa . 90 parts In-Stock

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$7.663

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90

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AZTECH Wire

Italy . 714 parts In-Stock

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$9.587

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Parana Technologies

USA . 1,826 parts In-Stock

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$18.501

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$18.614

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DigiPath Technology Company

USA . 116 parts In-Stock

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$20.372

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$18.742

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ChromeModa Solutions

Germany . 5,558 parts In-Stock

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$20.788

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$17.046

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IDEA Electronic Components Group

UK . 2,027 parts In-Stock

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$20.788

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$19.749

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$18.709

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2,027

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Continental Prestige Electronics

USA . 6,747 parts In-Stock

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Corphita

USA . 1,332 parts In-Stock

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Argo Parts USA

USA . 449 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Advanced Electronics

New Zealand . 41 parts In-Stock

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Overview

Experience the next level of motion control with Texas Instruments' DRV8876NRGTR. This innovative BRUSH DC MOTOR CONTROLLER offers unmatched quality and reliability, making it the perfect choice for automotive applications and beyond. With a maximum output current of 3.5 A and a wide supply voltage range of 4.5 V to 37 V, this IC ensures optimal performance in any situation. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations and provides exceptional value for all your motion control needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy and compact integration into electronic devices, saving space and simplifying assembly.

Nominal Supply Voltage (Vsup): 24 V

The nominal supply voltage of 24V ensures compatibility with a wide range of applications and power sources.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product is suitable for high-temperature environments and applications.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C ensures reliability and functionality in diverse environmental conditions.

Maximum Output Current: 3.5 A

The high maximum output current capabilities make this product suitable for driving powerful DC motors in various applications.

Technical Specifications

Motion Control ICs DRV8876NRGTR attributes and parameters. Explore more Motion Control ICs devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PQCC-N16

Length:

3 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

3.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

37 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

24 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

3 mm

Trade Compliance

DRV8876NRGTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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