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LB11970RV-MPB-H

Onsemi

LB11970RV-MPB-H by Onsemi

LB11970RV-MPB-H by Onsemi is a Motion Control IC with 12V supply, 1.2A output current, and -30 to 90 °C operating range. Ideal for Brushless DC Motor Controllers, it features small outline packaging and dual terminals for versatile applications in various industries.

Median Price

$0.946

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 941 parts In-Stock

1+ parts

$0.773

100+ parts

$0.727

1k+ parts

$0.657

10k+ parts

-

941

$0.773

$0.727

$0.657

-

DigiKey

USA . 941 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.120

10k+ parts

-

941

-

-

$1.120

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 603 parts In-Stock

1+ parts

$0.700

100+ parts

-

1k+ parts

-

10k+ parts

-

603

$0.700

-

-

-

Vyrian

USA . 6,664 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,664

-

-

-

-

DigiKey Marketplace

USA . 941 parts In-Stock

1+ parts

-

100+ parts

$0.770

1k+ parts

-

10k+ parts

-

941

-

$0.770

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,407 parts In-Stock

1+ parts

$0.663

100+ parts

-

1k+ parts

-

10k+ parts

-

2,407

$0.663

-

-

-

Corohmni

South Africa . 402 parts In-Stock

1+ parts

$0.737

100+ parts

-

1k+ parts

-

10k+ parts

-

402

$0.737

-

-

-

Component Stockers USA

USA . 1,363 parts In-Stock

1+ parts

$0.750

100+ parts

$0.710

1k+ parts

-

10k+ parts

-

1,363

$0.750

$0.710

-

-

TANS Electronics

Latvia . 7,263 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,263

-

-

-

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Kulean Microsystems

USA . 4,077 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,077

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-

-

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UHIMA Technologies

Türkiye . 837 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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837

-

-

-

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SupplyDigital Components

Austria . 770 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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770

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-

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Problanco Electronics

Mexico . 439 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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439

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-

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Microchip USA

USA . 298 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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298

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Overview

Elevate your motion control applications with the LB11970RV-MPB-H by Onsemi. This high-quality brushless DC motor controller offers unparalleled performance and reliability, thanks to Onsemi's reputation for cutting-edge technology and innovation. Whether you're looking to enhance automation systems, robotics, or automotive electronics, this product delivers precise control and efficiency. Say goodbye to compromises and hello to seamless operation with the LB11970RV-MPB-H. Experience the value of superior design and functionality with Onsemi's Motion Control ICs. Elevate your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient installation on printed circuit boards, saving time and labor costs.

Nominal Supply Voltage (Vsup): 12 V

Compatible with a wide range of systems and applications that require a 12V power supply.

Maximum Operating Temperature: 90 °C

Ensures stable operation in high temperature environments, making it suitable for industrial applications.

Width (mm): 4.4 mm

Compact size allows for space-saving installation in tight areas or densely populated PCBs.

Technology: BIPOLAR

Provides precise and accurate control over the motion of connected devices, ensuring smooth operation.

Technical Specifications

Motion Control ICs LB11970RV-MPB-H attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

ALSO OPERATES IN 3.5 TO 16V SUPPLY

JESD-30 Code:

R-PDSO-G18

JESD-609 Code:

e6

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-30 Cel

Maximum Output Current:

1.2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP18,.25,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

18 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

LB11970RV-MPB-H Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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