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LB11961V-MPB-E

Onsemi

LB11961V-MPB-E by Onsemi

LB11961V-MPB-E by Onsemi is a Motion Control IC with 16 terminals, operating voltage of 4.5-16 V, and max output current of 1A. Ideal for Brushless DC Motor control applications due to its bipolar technology and compact design with low profile package style.

Median Price

$0.420

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,327 parts In-Stock

1+ parts

$0.420

100+ parts

$0.410

1k+ parts

$0.400

10k+ parts

-

2,327

$0.420

$0.410

$0.400

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 75 parts In-Stock

1+ parts

$0.399

100+ parts

-

1k+ parts

-

10k+ parts

-

75

$0.399

-

-

-

Vyrian

USA . 10,335 parts In-Stock

1+ parts

-

100+ parts

-

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10,335

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,661 parts In-Stock

1+ parts

$0.378

100+ parts

-

1k+ parts

-

10k+ parts

-

1,661

$0.378

-

-

-

Corohmni

South Africa . 260 parts In-Stock

1+ parts

$0.420

100+ parts

-

1k+ parts

-

10k+ parts

-

260

$0.420

-

-

-

AZTECH Wire

Italy . 506 parts In-Stock

1+ parts

$12.100

100+ parts

-

1k+ parts

-

10k+ parts

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506

$12.100

-

-

-

Problanco Electronics

Mexico . 7,805 parts In-Stock

1+ parts

-

100+ parts

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7,805

-

-

-

-

TANS Electronics

Latvia . 3,933 parts In-Stock

1+ parts

-

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3,933

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SupplyDigital Components

Austria . 3,720 parts In-Stock

1+ parts

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3,720

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Microchip USA

USA . 3,552 parts In-Stock

1+ parts

-

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3,552

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UHIMA Technologies

Türkiye . 559 parts In-Stock

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559

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Kulean Microsystems

USA . 349 parts In-Stock

1+ parts

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349

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Overview

Unlock the power of precise motion control with the LB11961V-MPB-E by Onsemi. Crafted with superior quality and expertise, this motion control IC offers unparalleled performance and reliability. Ideal for a wide range of applications, this product provides seamless integration and efficient operation. Experience the value and benefits of this innovative technology, designed to elevate your projects to new heights. Trust Onsemi for cutting-edge solutions that deliver results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, ensuring a long lifespan.

Surface Mount: YES

Enables easy and efficient mounting onto circuit boards, saving time during production.

Nominal Supply Voltage (Vsup): 12 V

Ideal voltage for power supply, ensuring optimal performance of the motion control IC.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Compact design allows for space-saving integration into various electronic devices.

Technology: BIPOLAR

Provides high power output and efficiency for controlling brushless DC motors.

Maximum Supply Voltage (Vsup): 16 V

Wide voltage range allows for compatibility with different power sources.

Technical Specifications

Motion Control ICs LB11961V-MPB-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e6

Length:

5.2 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-30 Cel

Maximum Output Current:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

24 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

LB11961V-MPB-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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