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LB11867FV-TLM-E

Onsemi

LB11867FV-TLM-E by Onsemi

LB11867FV-TLM-E by Onsemi is a Motion Control IC with 16 terminals, operating voltage of 5.5-16 V, and max output current of 0.02 A. Ideal for Brushless DC Motor Controllers, it has a compact rectangular package suitable for surface mount applications at temperatures ranging from -30 to 95 °C.

Median Price

$0.474

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

-

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$0.441

10k+ parts

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20,000

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-

$0.441

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Rochester

USA . 19,319 parts In-Stock

1+ parts

-

100+ parts

$0.506

1k+ parts

$0.420

10k+ parts

$0.374

19,319

-

$0.506

$0.420

$0.374

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,353 parts In-Stock

1+ parts

$0.394

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2,353

$0.394

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Chip Stock

USA . 53,000 parts In-Stock

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53,000

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Flip Electronics

USA . 20,000 parts In-Stock

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Vyrian

USA . 6,931 parts In-Stock

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6,931

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Distributors (Availability)

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Ampacity Inc.

Singapore . 20,545 parts In-Stock

1+ parts

$0.353

100+ parts

-

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20,545

$0.353

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-

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Corphita

USA . 1,774 parts In-Stock

1+ parts

$0.374

100+ parts

-

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1,774

$0.374

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Corohmni

South Africa . 429 parts In-Stock

1+ parts

$0.415

100+ parts

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429

$0.415

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AZTECH Wire

Italy . 506 parts In-Stock

1+ parts

$14.000

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506

$14.000

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Component Stockers USA

USA . 757 parts In-Stock

1+ parts

$99.990

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757

$99.990

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TANS Electronics

Latvia . 6,634 parts In-Stock

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6,634

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Futuretech Components

Singapore . 5,520 parts In-Stock

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5,520

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Kulean Microsystems

USA . 4,553 parts In-Stock

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4,553

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Kepictronics

USA . 1,980 parts In-Stock

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1,980

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SupplyDigital Components

Austria . 1,926 parts In-Stock

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1,926

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Problanco Electronics

Mexico . 1,014 parts In-Stock

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1,014

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Microchip USA

USA . 430 parts In-Stock

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430

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UHIMA Technologies

Türkiye . 132 parts In-Stock

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132

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Overview

Experience the next level of motion control with the LB11867FV-TLM-E by Onsemi. Crafted with precision and quality, this small outline low profile IC offers unparalleled performance for your brushless DC motor controller applications. With a nominal supply voltage of 12V and a wide operating temperature range, this innovative product ensures reliability and efficiency in your projects. Trust Onsemi's expertise in motion control ICs to bring value, benefits, and advantages to your designs like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good durability and protection for the IC, making it suitable for various applications.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and resources.

Nominal Supply Voltage (Vsup): 12 V

Provides a stable supply voltage for consistent performance.

Maximum Operating Temperature: 95 °C

Can operate in high temperature environments without any issues.

Minimum Operating Temperature: -30 °C

Capable of functioning in low temperature conditions as well.

Technology: BIPOLAR

Utilizes bipolar technology for efficient control of motion in applications.

Technical Specifications

Motion Control ICs LB11867FV-TLM-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e6

Length:

5.2 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-30 Cel

Maximum Output Current:

.02 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

9.5 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

5.5 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

LB11867FV-TLM-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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