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LB11693JH-TLM-E

Onsemi

LB11693JH-TLM-E by Onsemi

LB11693JH-TLM-E by Onsemi is a Motion Control IC with 36 terminals, operating at -40 to 85 °C. It supports a supply voltage range of 8-28V and can handle a max output current of 1.8A. Ideal for industrial applications requiring precise control over brushless DC motors.

Median Price

$1.348

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 16,000 parts In-Stock

1+ parts

-

100+ parts

$1.270

1k+ parts

$1.140

10k+ parts

$1.070

16,000

-

$1.270

$1.140

$1.070

Verical

USA . 8,000 parts In-Stock

1+ parts

-

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$1.425

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8,000

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$1.425

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Distributors (In-Stock)

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Digiode

USA . 1,198 parts In-Stock

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$1.349

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Vyrian

USA . 2,366 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 394 parts In-Stock

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394

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Bristol Electronics

USA . 394 parts In-Stock

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394

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Dan-Mar Components

USA . 394 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 186 parts In-Stock

1+ parts

$1.250

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186

$1.250

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Corphita

USA . 1,277 parts In-Stock

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$1.278

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$1.278

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Component Stockers USA

USA . 13,667 parts In-Stock

1+ parts

$1.440

100+ parts

$1.350

1k+ parts

$1.230

10k+ parts

$1.230

13,667

$1.440

$1.350

$1.230

$1.230

AZTECH Wire

Italy . 671 parts In-Stock

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$14.400

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671

$14.400

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$18.886

100+ parts

$17.186

1k+ parts

$15.487

10k+ parts

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500

$18.886

$17.186

$15.487

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QUARKTWIN TECHNOLOGY LTD

USA . 22,870 parts In-Stock

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Continental Prestige Electronics

USA . 16,000 parts In-Stock

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$1.210

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16,000

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$1.210

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Problanco Electronics

Mexico . 4,911 parts In-Stock

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TANS Electronics

Latvia . 4,674 parts In-Stock

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Kulean Microsystems

USA . 1,565 parts In-Stock

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1,565

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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SupplyDigital Components

Austria . 1,342 parts In-Stock

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UHIMA Technologies

Türkiye . 291 parts In-Stock

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291

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Microchip USA

USA . 120 parts In-Stock

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120

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Overview

Unleash the power of motion control with the LB11693JH-TLM-E by Onsemi. Crafted with precision and reliability, this motion control IC offers unparalleled performance for a wide range of applications. From robotics to automotive systems, this product delivers superior quality and efficiency. Experience seamless operation and enhanced functionality with Onsemi's cutting-edge technology. Elevate your projects with the LB11693JH-TLM-E and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection to the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Being surface mountable makes the installation process easier and more efficient, particularly in high-volume manufacturing processes.

Nominal Supply Voltage (Vsup): 24 V

The nominal supply voltage of 24V allows for compatibility with a wide range of power sources, making it versatile for various applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product can withstand harsh environmental conditions and continuous operation without overheating.

Maximum Output Current: 1.8 A

The high maximum output current of 1.8A enables this motion control IC to drive motors with higher power requirements, making it suitable for a variety of motor control applications.

Technical Specifications

Motion Control ICs LB11693JH-TLM-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e6

Length:

17.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1.8 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP36/44,.4,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

24

Qualification:

Not Qualified

Maximum Seated Height:

2.45 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

13.5 mA

Maximum Supply Voltage (Vsup):

28 V

Minimum Supply Voltage (Vsup):

8 V

Nominal Supply Voltage (Vsup):

24 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.9 mm

Trade Compliance

LB11693JH-TLM-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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