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PDRV8245SPWPQ1

Texas Instruments

PDRV8245SPWPQ1 by Texas Instruments

PDRV8245SPWPQ1 by Texas Instruments is a Motion Control IC with AEC-Q100 screening. It operates b/w -40 to 125 °C, supporting a Vsup range of 4.5V to 35V and delivering up to 32A output current. Ideal for automotive applications due to its robust design and high performance in controlling half bridge brush DC motors.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,402 parts In-Stock

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Vyrian

USA . 2,842 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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50

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One Stop Electronics

USA . 1,090 parts In-Stock

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$1.500

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$1.500

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Ampacity Inc.

Singapore . 325 parts In-Stock

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$3.500

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$3.500

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Parana Technologies

USA . 217 parts In-Stock

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$4.079

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$4.540

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$4.079

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ChromeModa Solutions

Germany . 5,849 parts In-Stock

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$4.583

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$3.758

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$4.583

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IDEA Electronic Components Group

UK . 2,267 parts In-Stock

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$4.583

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$4.125

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AZTECH Wire

Italy . 418 parts In-Stock

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$13.991

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Corohmni

South Africa . 767 parts In-Stock

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$15.905

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Continental Prestige Electronics

USA . 4,317 parts In-Stock

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Corphita

USA . 2,336 parts In-Stock

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DigiPath Technology Company

USA . 548 parts In-Stock

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$4.132

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Argo Parts USA

USA . 459 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Experience the cutting-edge technology of motion control with the PDRV8245SPWPQ1 by Texas Instruments. Crafted with precision and reliability, this product is a testament to the quality that TI is known for. Perfect for a wide range of applications, this motion control IC offers unparalleled performance and efficiency. Unlock a world of possibilities with the PDRV8245SPWPQ1 and elevate your projects to new heights. Choose Texas Instruments for superior products that deliver value and innovation every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and cost during manufacturing.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and performance, making it suitable for automotive applications.

Nominal Supply Voltage (Vsup): 13.5 V

Optimal voltage for operating the IC efficiently, ensuring stable performance.

No. of Terminals: 28

Provides flexibility for interfacing with other components in a system, allowing for versatile integration.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for use in harsh environments.

Minimum Operating Temperature: -40 °C

Provides a wide operating temperature range, ensuring functionality in extreme cold conditions.

Maximum Output Current: 32 A

Allows for driving high current loads, making it suitable for applications requiring high power output.

Technology: BICMOS

Combines the benefits of bipolar and CMOS technologies, offering high speed and low power consumption.

Technical Specifications

Motion Control ICs PDRV8245SPWPQ1 attributes and parameters. Explore more Motion Control ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G28

Length:

9.7 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

32 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

35 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

13.5 V

Surface Mount:

YES

Technology:

BICMOS

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

PDRV8245SPWPQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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