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LA73074CL

Onsemi

LA73074CL by Onsemi

LA73074CL by Onsemi is a small outline audio & video amplifier with 10 terminals. Operating temperature ranges from -20 to 85 °C, powered by a 3.1V supply at max current of 30mA. Ideal for applications requiring bipolar technology in surface mount packages.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,375 parts In-Stock

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Digiode

USA . 2,223 parts In-Stock

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2,223

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SupplyDigital Components

Austria . 6,230 parts In-Stock

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Kulean Microsystems

USA . 5,679 parts In-Stock

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TANS Electronics

Latvia . 4,497 parts In-Stock

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Problanco Electronics

Mexico . 3,438 parts In-Stock

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Corphita

USA . 1,557 parts In-Stock

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Corohmni

South Africa . 373 parts In-Stock

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UHIMA Technologies

Türkiye . 367 parts In-Stock

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Overview

Enhance your audio and video experiences with the LA73074CL by Onsemi. Known for their top-notch quality and reliability, Onsemi has crafted this audio and video amplifier to deliver exceptional performance in a wide range of applications. From enhancing sound systems to improving video quality, this product offers unparalleled value and benefits to customers. With its compact package style and advanced technology, the LA73074CL is the perfect solution for all your audio and video amplification needs. Elevate your entertainment experience today with Onsemi's cutting-edge amplifier.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and longevity of the product, making it a reliable choice for long-term use.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into various devices or systems without the need for additional mounting hardware.

Power Supplies (V): 3.1

With a power supply of 3.1V, this amplifier is efficient and energy-saving, providing optimal performance while reducing power consumption.

No. of Terminals: 10

Having 10 terminals allows for versatile connectivity options, making it suitable for a wide range of audio and video applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures stable performance even in demanding operating conditions, enhancing the reliability of the product.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature of -20 °C ensures that the amplifier can function effectively in a wide range of environments, making it a versatile choice for various applications.

Technology: BIPOLAR

Bipolar technology offers high performance and efficiency, providing clear and high-quality audio and video amplification for an enhanced user experience.

Maximum Supply Current: 30 mA

With a maximum supply current of 30mA, this amplifier operates efficiently and effectively, delivering consistent power output for optimal performance.

Terminal Pitch: 0.635 mm

The small terminal pitch of 0.635mm allows for compact and space-saving design, making it suitable for integration into various compact electronic devices or systems.

Technical Specifications

Audio & Video Amplifiers LA73074CL attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-N10

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC10,.08,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.1

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

30 mA

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

LA73074CL General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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