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LA73076V-TLM-E

Onsemi

LA73076V-TLM-E by Onsemi

LA73076V-TLM-E by Onsemi is a 16-terminal audio/video amplifier with 3.1V power supply, operating b/w -20 °C to 80°C. Its small outline package and gull wing terminals make it suitable for commercial extended temperature applications requiring up to 44mA supply current.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Cyclops Electronics Ltd

UK . 10,900 parts In-Stock

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10,900

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Vyrian

USA . 2,551 parts In-Stock

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2,551

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Digiode

USA . 1,991 parts In-Stock

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1,991

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Distributors (Availability)

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AZTECH Wire

Italy . 706 parts In-Stock

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$16.820

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706

$16.820

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Kepictronics

USA . 8,900 parts In-Stock

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8,900

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Kulean Microsystems

USA . 4,814 parts In-Stock

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Microchip USA

USA . 4,245 parts In-Stock

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4,245

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Problanco Electronics

Mexico . 3,485 parts In-Stock

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SupplyDigital Components

Austria . 2,741 parts In-Stock

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Corphita

USA . 2,041 parts In-Stock

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TANS Electronics

Latvia . 1,318 parts In-Stock

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1,318

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Corohmni

South Africa . 477 parts In-Stock

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477

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UHIMA Technologies

Türkiye . 393 parts In-Stock

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393

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Overview

Upgrade your audio and video experience with the LA73076V-TLM-E by Onsemi. This top-of-the-line amplifier offers unmatched quality and reliability, backed by the reputable manufacturer Onsemi. Perfect for a wide range of applications, this product provides clear and powerful sound with ease. Enhance your entertainment setup and enjoy superior performance with the LA73076V-TLM-E. Elevate your audio and video experience today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material ensures durability and protection for the internal components of the amplifier, making it a reliable choice for long-term use.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation of the amplifier onto circuit boards, saving space and reducing assembly time.

Power Supplies (V): 3.1

The 3.1 V power supply enables the amplifier to operate efficiently while consuming minimal power, making it suitable for various low power applications.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style results in a compact design, ideal for applications where space is limited without compromising on performance.

Maximum Operating Temperature: 80 °C

With a maximum operating temperature of 80 °C, this amplifier can withstand high temperature environments, ensuring reliable operation even under challenging conditions.

Minimum Operating Temperature: -20 °C

The minimum operating temperature of -20 °C allows the amplifier to function effectively in colder environments, providing versatility in usage.

Terminal Finish: Tin/Bismuth (Sn/Bi)

The tin/bismuth terminal finish enhances the conductivity and solderability of the terminals, ensuring secure connections for seamless performance.

Maximum Supply Current: 44 mA

With a maximum supply current of 44 mA, this amplifier operates efficiently without drawing excessive power, contributing to energy savings and reduced operational costs.

Terminal Pitch: 0.635 mm

The 0.635 mm terminal pitch allows for precise and secure connections, ensuring stable signal transmission and minimal signal loss throughout the circuit.

Moisture Sensitivity Level (MSL): 3

With an MSL level of 3, this amplifier is resistant to moisture damage, making it suitable for use in various environments where humidity may be a concern.

Technical Specifications

Audio & Video Amplifiers LA73076V-TLM-E attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

16

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

3.1

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

44 mA

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

LA73076V-TLM-E General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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