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LA73060V

Onsemi

LA73060V by Onsemi

LA73060V by Onsemi is a video amplifier IC with 36 terminals, operating at -20 to 75 °C. It has a power supply of 5V and max current of 105mA. Ideal for audio/video applications, it features a small outline package in plastic/epoxy material for surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,346 parts In-Stock

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Vyrian

USA . 1,391 parts In-Stock

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1,391

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Distributors (Availability)

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TANS Electronics

Latvia . 6,648 parts In-Stock

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6,648

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Kulean Microsystems

USA . 6,056 parts In-Stock

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6,056

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Problanco Electronics

Mexico . 5,775 parts In-Stock

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SupplyDigital Components

Austria . 3,543 parts In-Stock

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Corphita

USA . 1,373 parts In-Stock

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1,373

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UHIMA Technologies

Türkiye . 309 parts In-Stock

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309

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Corohmni

South Africa . 79 parts In-Stock

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Overview

Enhance your audio and video systems with the LA73060V by Onsemi. Known for their high-quality manufacturing, Onsemi's Audio & Video Amplifiers are a top choice for professionals seeking reliable performance. This versatile device offers exceptional value with its compact design and low power consumption, making it ideal for a wide range of applications. Whether you're looking to boost your sound system or enhance video quality, the LA73060V delivers the benefits and advantages that customers need for superior audio and video experiences. Elevate your technology with Onsemi today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability to the product, making it suitable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and flexible installation options, making it convenient to integrate into different setups.

Package Shape: RECTANGULAR

Rectangular package shape is compact and space-saving, ideal for products where size is a constraint.

Power Supplies (V): 5

Operating at 5V makes it energy-efficient and compatible with various power sources.

No. of Terminals: 36

Having 36 terminals enables versatility in connectivity options and allows for complex configurations.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline and shrink pitch package style saves space and contributes to the overall compact design of the product.

Maximum Operating Temperature: 75 °C

With a maximum operating temperature of 75 °C, the amplifier can perform reliably even in relatively high-temperature environments.

Minimum Operating Temperature: -20 °C

The ability to operate at -20 °C ensures that the amplifier remains functional in colder conditions.

Terminal Position: DUAL

Dual terminal position provides redundancy and increases connection stability for a more robust performance.

Temperature Grade: COMMERCIAL EXTENDED

Designed for commercial extended temperature range, making it suitable for a wide range of applications and environments.

Technology: BIPOLAR

Bipolar technology offers high precision and low noise amplification, ensuring high-quality audio and video output.

Terminal Form: GULL WING

Gull wing terminal form simplifies the installation process and facilitates soldering, enhancing overall ease of use.

Maximum Supply Current: 105 mA

With a maximum supply current of 105 mA, the amplifier operates efficiently and without excessive power consumption.

Terminal Pitch: 0.8 mm

The tight terminal pitch of 0.8 mm allows for a compact layout and enhances the overall integration capabilities of the product.

Technical Specifications

Audio & Video Amplifiers LA73060V attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G36

No. of Terminals:

36

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP36,.3,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

105 mA

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Trade Compliance

LA73060V General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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