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LA73054

Onsemi

LA73054 by Onsemi

LA73054 by Onsemi is a video amplifier IC with 36 terminals, operating b/w -20 °C to 70°C. It has a power supply of 5V and uses bipolar technology. This small outline package is surface mountable and ideal for audio/video applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 1,131 parts In-Stock

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Digiode

USA . 150 parts In-Stock

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Prism Electronics

USA . 60 parts In-Stock

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TANS Electronics

Latvia . 7,914 parts In-Stock

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Kulean Microsystems

USA . 7,805 parts In-Stock

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SupplyDigital Components

Austria . 7,196 parts In-Stock

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Problanco Electronics

Mexico . 6,978 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Corphita

USA . 1,207 parts In-Stock

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Kepictronics

USA . 443 parts In-Stock

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Corohmni

South Africa . 404 parts In-Stock

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UHIMA Technologies

Türkiye . 123 parts In-Stock

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Perfect Parts

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Overview

Elevate your audio and video experience with the LA73054 by Onsemi. Known for their superior quality and reliability, Onsemi delivers cutting-edge technology in the field of Audio & Video Amplifiers. This innovative product offers seamless integration, crystal-clear sound, and vibrant visuals, making it ideal for a wide range of applications. Whether you're a professional looking to enhance your audiovisual projects or a savvy consumer seeking top-notch entertainment systems, the LA73054 provides unmatched value and performance. Upgrade your setup today and immerse yourself in a world of unparalleled audio and video excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable applications.

Surface Mount: YES

Being surface mountable makes installation easier and more convenient, especially for compact systems.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space and easy placement on circuit boards.

General IC Type: VIDEO AMPLIFIER

Specifically designed for video amplification, ensuring high-quality video output for enhanced viewing experience.

Power Supplies (V): 5

Operates at a low voltage of 5V, making it energy-efficient and suitable for a variety of power sources.

No. of Terminals: 36

With a high number of terminals, this amplifier can support multiple connections and provide versatile connectivity options.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style allows for compact integration and space-saving design in electronic devices.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this amplifier can withstand high temperatures and maintain optimal performance.

Minimum Operating Temperature: -20 °C

Capable of operating at low temperatures down to -20 °C, making it suitable for use in various environmental conditions.

Terminal Position: DUAL

The dual terminal position provides flexibility in circuit board layout and easy connection to other components.

Temperature Grade: COMMERCIAL

Designed for commercial use, ensuring reliability and consistent performance in professional audio/video applications.

Technology: BIPOLAR

Utilizes bipolar technology for efficient signal amplification and high-quality video output.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and secure attachment to circuit boards, ensuring reliable connections.

Terminal Pitch: 0.8 mm

With a small terminal pitch of 0.8mm, this amplifier supports fine-pitch connections and compact circuit board design.

Technical Specifications

Audio & Video Amplifiers LA73054 attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G36

No. of Terminals:

36

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP36,.3,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Trade Compliance

LA73054 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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