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LA73062V

Onsemi

LA73062V by Onsemi

LA73062V by Onsemi is a video amplifier IC with 36 terminals and operates on 5V power supply. It features a max operating temperature of 70 °C, min of -20°C, and consumes up to 104mA current. Ideal for audio/video applications requiring high-quality signal amplification in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,305 parts In-Stock

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2,305

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Digiode

USA . 1,731 parts In-Stock

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1,731

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Distributors (Availability)

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TANS Electronics

Latvia . 7,067 parts In-Stock

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7,067

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Kulean Microsystems

USA . 6,719 parts In-Stock

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6,719

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Problanco Electronics

Mexico . 5,934 parts In-Stock

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5,934

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Corphita

USA . 2,030 parts In-Stock

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2,030

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SupplyDigital Components

Austria . 419 parts In-Stock

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Corohmni

South Africa . 126 parts In-Stock

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UHIMA Technologies

Türkiye . 70 parts In-Stock

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Overview

Enhance your audio and video experiences with the LA73062V by Onsemi. Known for their superior quality and reliability, Onsemi amplifiers deliver crystal-clear sound and sharp visuals for a truly immersive entertainment experience. Whether you're watching movies, gaming, or listening to music, this video amplifier ensures optimal performance and seamless connectivity. Upgrade your home entertainment setup with the LA73062V and enjoy the benefits of top-notch technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and reliability of the amplifier, making it a good choice for long-term use.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving design, making it convenient for various applications.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact and sleek design, suitable for integration into different audio and video systems.

Power Supplies (V): 5

Operating at 5V, this amplifier is energy-efficient while still delivering high-quality performance, making it a cost-effective choice.

No. of Terminals: 36

With 36 terminals, this amplifier offers versatile connectivity options, allowing for multiple input and output connections for enhanced functionality.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70 °C ensures reliable performance even in challenging environmental conditions, making it a durable choice.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature of -20 °C allows for operation in a wide range of environments, making this amplifier versatile and suitable for various applications.

Technology: BIPOLAR

Utilizing bipolar technology ensures high-speed performance and low noise levels, resulting in clear and crisp audio and video output, making it a high-quality choice.

Technical Specifications

Audio & Video Amplifiers LA73062V attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G36

No. of Terminals:

36

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP36,.3,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

104 mA

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Trade Compliance

LA73062V General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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