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LA73076V-MPB-E

Onsemi

LA73076V-MPB-E by Onsemi

LA73076V-MPB-E by Onsemi is a 16-terminal audio/video amplifier with 3.1V power supply, operating b/w -20 °C to 80°C. Its small outline package and surface mount design make it ideal for commercial extended temperature applications. With a max supply current of 44mA, this amplifier offers high performance in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,190 parts In-Stock

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Vyrian

USA . 939 parts In-Stock

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939

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Distributors (Availability)

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Microchip USA

USA . 4,958 parts In-Stock

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4,958

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Kulean Microsystems

USA . 4,489 parts In-Stock

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4,489

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TANS Electronics

Latvia . 2,959 parts In-Stock

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Corphita

USA . 2,265 parts In-Stock

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2,265

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Problanco Electronics

Mexico . 1,947 parts In-Stock

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SupplyDigital Components

Austria . 254 parts In-Stock

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Corohmni

South Africa . 105 parts In-Stock

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UHIMA Technologies

Türkiye . 58 parts In-Stock

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Overview

Elevate your audio and video experience with the LA73076V-MPB-E by Onsemi. Crafted with precision and quality, this amplifier delivers unparalleled performance and reliability. Whether you're enhancing your home entertainment system or perfecting your sound design, this product offers unmatched value and benefits. Unleash the full potential of your devices with Onsemi's cutting-edge technology. Elevate your audiovisual experience today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and lightweight, making the amplifier easy to handle and transport.

Surface Mount: YES

Surface mount technology allows for easy integration onto circuit boards, saving space and reducing overall assembly costs.

Power Supplies (V): 3.1

Low power supply voltage of 3.1V enables efficient power consumption and longer battery life in portable devices.

No. of Terminals: 16

Having 16 terminals provides multiple connection points for various input and output sources, increasing versatility and functionality of the amplifier.

Maximum Operating Temperature: 80 °C

High maximum operating temperature of 80 °C ensures stable performance even in demanding environmental conditions.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature of -20 °C allows the amplifier to function reliably in cold environments.

Terminal Finish: Tin/Bismuth (Sn/Bi)

Tin/Bismuth terminal finish provides corrosion resistance and ensures stable electrical connections for extended product lifespan.

Maximum Supply Current: 44 mA

Maximum supply current of 44 mA allows the amplifier to deliver sufficient power output for improved audio and video performance.

Moisture Sensitivity Level (MSL): 3

Moisture Sensitivity Level of 3 indicates that the amplifier can withstand moderate exposure to moisture during storage and operation.

Technical Specifications

Audio & Video Amplifiers LA73076V-MPB-E attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

16

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

3.1

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

44 mA

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

LA73076V-MPB-E General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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