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TFA9879HN

NXP Semiconductors

TFA9879HN by NXP Semiconductors

The NXP Semiconductors TFA9879HN is a 24-terminal audio amplifier chip with a nominal output power of 2.75W. It operates b/w -20°C to 85°C, suitable for various audio and video applications. The package style includes chip carrier, heat sink/slug, and very thin profile, making it versatile for compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,690 parts In-Stock

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2,690

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Digiode

USA . 1,214 parts In-Stock

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Vyrian

USA . 1,068 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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One Stop Electronics

USA . 771 parts In-Stock

1+ parts

$4.800

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771

$4.800

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Ampacity Inc.

Singapore . 468 parts In-Stock

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$8.800

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468

$8.800

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AZTECH Wire

Italy . 870 parts In-Stock

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$12.288

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870

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UNI Independent Distributors

Spain . 5,403 parts In-Stock

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Argo Parts USA

USA . 3,421 parts In-Stock

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Corphita

USA . 1,151 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Lixinc

USA . 397 parts In-Stock

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397

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Continental Prestige Electronics

USA . 307 parts In-Stock

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Overview

Elevate your audio experience with the TFA9879HN by NXP Semiconductors. This high-quality audio amplifier offers unmatched performance and reliability, thanks to the renowned manufacturer's expertise in semiconductor technology. Ideal for a wide range of applications in the Audio & Video Amplifiers category, this product provides clear, powerful sound with a nominal output power of 2.75 W. With a compact design and advanced features, the TFA9879HN is the perfect choice for customers seeking superior audio amplification. Experience the difference with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the amplifier, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

General IC Type: AUDIO AMPLIFIER

Specifically designed for audio amplification, resulting in high-quality sound output for your audio devices.

Nominal Output Power: 2.75 W

Delivers sufficient power for amplifying audio signals, providing clear and loud sound reproduction.

Minimum Supply Voltage (Vsup): 2.5 V

Works efficiently with low supply voltages, making it suitable for portable and low-power applications.

Technical Specifications

Audio & Video Amplifiers TFA9879HN attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

Additional Features:

IT ALSO REQUIRES 1.8V DIGITAL NOMINAL SUPPLY VOLTAGE

General IC Type:

JESD-30 Code:

S-PQCC-N24

Length:

4 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Nominal Output Power:

2.75 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

TFA9879HN General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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