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TFA9810T/N1

NXP Semiconductors

TFA9810T/N1 by NXP Semiconductors

TFA9810T/N1 by NXP Semiconductors is a versatile audio amplifier designed for industrial applications, operating b/w -40 °C and 85 °C. It features a compact 32-terminal package with a max supply current of 45 mA and supports up to 12V power supplies. Ideal for surface mount designs, it offers four functions in a small outline format.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Cyclops Electronics Ltd

UK . 19,850 parts In-Stock

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19,850

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Vyrian

USA . 2,286 parts In-Stock

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2,286

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Digiode

USA . 955 parts In-Stock

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955

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Anansix

USA . 421 parts In-Stock

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421

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ACDS - Activité Composants Distribution Service

France . 14 parts In-Stock

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14

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 2,129 parts In-Stock

1+ parts

$10.885

100+ parts

-

1k+ parts

$10.450

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$10.450

2,129

$10.885

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$10.450

$10.450

One Stop Electronics

USA . 888 parts In-Stock

1+ parts

$13.800

100+ parts

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888

$13.800

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Metaverse IC Inc.

Canada . 19,980 parts In-Stock

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19,980

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GreenTree Electronics

Israel . 16,850 parts In-Stock

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16,850

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Kepictronics

USA . 12,430 parts In-Stock

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12,430

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UNI Independent Distributors

Spain . 8,300 parts In-Stock

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8,300

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A-Z Elektronik GmbH

Germany . 1,929 parts In-Stock

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1,929

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Corphita

USA . 1,679 parts In-Stock

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1,679

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Assy Fe

Spain . 1,134 parts In-Stock

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1,134

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Perfect Parts

USA . 164 parts In-Stock

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164

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Cyclops Electronics Ltd (Excess)

UK . 14 parts In-Stock

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14

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Overview

Experience superior sound quality with the TFA9810T/N1 audio amplifier from NXP Semiconductors, a leader in innovative technology solutions. Its compact design and robust features make it ideal for a variety of applications, from consumer electronics to industrial equipment. Enjoy crystal-clear audio performance, energy efficiency, and long-lasting durability, ensuring that your devices deliver exceptional sound without compromise. Elevate your audio experience today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as a package body material ensures durability and protection against environmental factors, making it a reliable choice for various applications.

Surface Mount: YES

Being surface mount compatible allows for compact designs and ease of integration onto PCBs, enhancing the versatility of the amplifier in various electronic setups.

No. of Functions: 4

With four different functions, this audio amplifier can handle multiple audio channels or tasks, providing flexibility for a wide range of audio applications.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient layout on circuit boards, optimizing space and improving aesthetics in product design.

General IC Type: AUDIO AMPLIFIER

As a specialized audio amplifier, this IC is designed to deliver high-quality sound amplification, making it suitable for audio-centric products.

Power Supplies (V): 12

Operating on a 12V power supply allows for compatibility with many audio and electronic systems, simplifying integration into existing setups.

No. of Terminals: 32

Having 32 terminals provides sufficient connection options for input and output signals, enabling complex wiring configurations and functionalities.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained designs, allowing manufacturers to produce smaller and more efficient devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this amplifier can function in a variety of environments without risk of overheating, ensuring reliability.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this component suitable for extreme conditions, expanding its usability in diverse applications.

Terminal Position: DUAL

The dual terminal position design provides flexible connectivity options, making it easier to integrate into various circuit designs.

Temperature Grade: INDUSTRIAL

Rated for industrial temperatures, this amplifier is built for high performance in demanding environments, ensuring longevity and reliability.

Terminal Form: GULL WING

Gull wing terminals offer enhanced soldering and mechanical strength, improving the connection reliability in circuit assemblies.

Maximum Supply Current: 45 mA

A maximum supply current of 45 mA indicates efficient power consumption, making it ideal for battery-operated devices or energy-sensitive applications.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is a standard for many applications, providing compatibility with a range of circuit boards and simplifying manufacturing processes.

Technical Specifications

Audio & Video Amplifiers TFA9810T/N1 attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G32

No. of Functions:

4

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP32,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

12

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

45 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

TFA9810T/N1 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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