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LA6588MC-BH

Onsemi

LA6588MC-BH by Onsemi

LA6588MC-BH by Onsemi is a Motion Control IC with 24V supply voltage, suitable for Brushless DC Motor control. It features a small outline package, dual terminal position, and 0.8A max output current. Ideal for applications requiring precise motor control in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,093 parts In-Stock

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Digiode

USA . 154 parts In-Stock

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154

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AZTECH Wire

Italy . 1,146 parts In-Stock

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$8.300

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$8.300

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Component Stockers USA

USA . 462 parts In-Stock

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$99.990

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462

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Kulean Microsystems

USA . 7,693 parts In-Stock

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TANS Electronics

Latvia . 6,939 parts In-Stock

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Problanco Electronics

Mexico . 2,083 parts In-Stock

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UHIMA Technologies

Türkiye . 969 parts In-Stock

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969

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Corphita

USA . 815 parts In-Stock

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SupplyDigital Components

Austria . 712 parts In-Stock

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Microchip USA

USA . 340 parts In-Stock

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Corohmni

South Africa . 301 parts In-Stock

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Overview

Elevate your motion control projects with the LA6588MC-BH by Onsemi. Crafted with precision and reliability, this brushless DC motor controller offers unparalleled performance in a compact package. Whether you're designing robotics, automation systems, or drones, this innovative IC provides seamless operation with its high-quality components and advanced technology. Experience the value of smooth and efficient motion control with the LA6588MC-BH by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for a variety of applications.

Surface Mount: YES

The surface mount feature allows for easy installation and integration onto circuit boards, saving space and simplifying the manufacturing process.

Nominal Supply Voltage (Vsup): 24 V

The nominal supply voltage of 24 V is a common and easy-to-source power requirement, making this product compatible with a wide range of power sources.

Maximum Operating Temperature: 90 °C

With a maximum operating temperature of 90 °C, this product can withstand high temperatures, ensuring reliable performance in harsh environments.

Minimum Operating Temperature: -30 °C

The minimum operating temperature of -30 °C allows the product to function effectively in cold conditions, making it versatile for various applications.

Maximum Supply Current (Isup): 9.5 mA

The low maximum supply current requirement of 9.5 mA helps in reducing power consumption, making it energy-efficient and cost-effective in the long run.

Technical Specifications

Motion Control ICs LA6588MC-BH attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

SEATED HGT-NOM

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e2

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-30 Cel

Maximum Output Current:

.8 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP10,.25,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

24

Qualification:

Not Qualified

Maximum Seated Height:

1.55 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

9.5 mA

Maximum Supply Voltage (Vsup):

26.4 V

Minimum Supply Voltage (Vsup):

8 V

Nominal Supply Voltage (Vsup):

24 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

GULL WING

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

LA6588MC-BH Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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