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LA6584M-MPB-E

Onsemi

LA6584M-MPB-E by Onsemi

LA6584M-MPB-E by Onsemi is a Motion Control IC with 12V supply, 1.6A output current, and 16 terminals in a small outline package. Ideal for Brushless DC Motor control applications with operating temperatures from -30 to 90 °C.

Median Price

$1.240

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 991 parts In-Stock

1+ parts

-

100+ parts

$1.100

1k+ parts

$0.913

10k+ parts

$0.814

991

-

$1.100

$0.913

$0.814

DigiKey

USA . 991 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.380

10k+ parts

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991

-

-

$1.380

-

Distributors (In-Stock)

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Digiode

USA . 2,296 parts In-Stock

1+ parts

$0.854

100+ parts

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2,296

$0.854

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Vyrian

USA . 11,553 parts In-Stock

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11,553

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Distributors (Availability)

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Ampacity Inc.

Singapore . 675 parts In-Stock

1+ parts

$0.670

100+ parts

-

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675

$0.670

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Corohmni

South Africa . 135 parts In-Stock

1+ parts

$0.793

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135

$0.793

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Corphita

USA . 593 parts In-Stock

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$0.809

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593

$0.809

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-

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Component Stockers USA

USA . 1,087 parts In-Stock

1+ parts

$0.930

100+ parts

$0.880

1k+ parts

-

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1,087

$0.930

$0.880

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QUARKTWIN TECHNOLOGY LTD

USA . 26,385 parts In-Stock

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26,385

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Kulean Microsystems

USA . 7,566 parts In-Stock

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7,566

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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6,000

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SupplyDigital Components

Austria . 4,855 parts In-Stock

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Problanco Electronics

Mexico . 4,075 parts In-Stock

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TANS Electronics

Latvia . 3,732 parts In-Stock

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3,732

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Continental Prestige Electronics

USA . 991 parts In-Stock

1+ parts

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100+ parts

$0.768

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991

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$0.768

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UHIMA Technologies

Türkiye . 359 parts In-Stock

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359

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Microchip USA

USA . 230 parts In-Stock

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230

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Overview

Elevate your motion control capabilities with the LA6584M-MPB-E by Onsemi. Crafted with precision and quality, this brushless DC motor controller offers unrivaled performance and reliability. Perfect for a wide range of applications, this compact and powerful IC provides seamless operation and efficiency. Experience the value and benefits that Onsemi brings to the table with this innovative solution. Upgrade your motion control systems today with the LA6584M-MPB-E and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers good durability and protection for the IC, making it suitable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto PCBs, saving space and simplifying assembly.

Nominal Supply Voltage (Vsup): 12 V

Operating at a nominal supply voltage of 12V provides a reliable power source for the IC to function optimally.

Power Supplies (V): 12

Having a consistent power supply of 12V ensures stable performance of the IC in various operating conditions.

Maximum Operating Temperature: 90 °C

With a maximum operating temperature of 90 °C, this IC can withstand high temperatures without compromising its functionality.

Technology: BIPOLAR

Utilizing bipolar technology offers efficient and precise control over the motion of the connected devices, enhancing performance.

Technical Specifications

Motion Control ICs LA6584M-MPB-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e6

Length:

12.5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-30 Cel

Maximum Output Current:

1.6 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP16/24,.3,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

9 mA

Maximum Supply Voltage (Vsup):

14 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Width (mm):

5.4 mm

Trade Compliance

LA6584M-MPB-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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