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FQP6N60C

Onsemi

FQP6N60C by Onsemi

FQP6N60C by Onsemi is a N-CHANNEL Power FET with 600V DS Breakdown Voltage, ideal for SWITCHING applications. It features a Max IDM of 22A and EAS of 300mJ, suitable for high-power operations. With an ID of 5.5A and RDS(on) of 2 ohm, this transistor operates in ENHANCEMENT MODE at up to 150 °C temperature.

Median Price

$1.035

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 34,816 parts In-Stock

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34,816

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Rochester

USA . 20,356 parts In-Stock

1+ parts

-

100+ parts

$0.997

1k+ parts

$0.828

10k+ parts

$0.738

20,356

-

$0.997

$0.828

$0.738

DigiKey

USA . 20,356 parts In-Stock

1+ parts

-

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$1.250

10k+ parts

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20,356

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$1.250

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Verical

USA . 20,000 parts In-Stock

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$1.035

10k+ parts

$0.923

20,000

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$1.035

$0.923

Distributors (In-Stock)

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Digiode

USA . 2,264 parts In-Stock

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$0.777

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2,264

$0.777

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Vyrian

USA . 1,388 parts In-Stock

1+ parts

$0.818

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1,388

$0.818

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Flip Electronics

USA . 34,816 parts In-Stock

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34,816

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DigiKey Marketplace

USA . 20,356 parts In-Stock

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$0.850

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$0.850

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Chip Stock

USA . 875 parts In-Stock

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875

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Bristol Electronics

USA . 50 parts In-Stock

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50

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ComSIT Distribution GmbH

Germany . 10 parts In-Stock

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10

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Distributors (Availability)

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Native Components

USA . 397 parts In-Stock

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$0.349

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$0.335

397

$0.349

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$0.335

Northwest PG Solutions

USA . 130 parts In-Stock

1+ parts

$0.384

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$0.339

130

$0.384

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$0.339

Corphita

USA . 1,520 parts In-Stock

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$0.736

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1,520

$0.736

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Corohmni

South Africa . 131 parts In-Stock

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$0.818

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131

$0.818

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Microchip USA

USA . 260 parts In-Stock

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$10.725

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$10.725

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Kepictronics

USA . 88,000 parts In-Stock

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TANS Electronics

Latvia . 5,419 parts In-Stock

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Kulean Microsystems

USA . 3,230 parts In-Stock

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Problanco Electronics

Mexico . 3,104 parts In-Stock

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Supply Digital

USA . 2,623 parts In-Stock

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SupplyDigital Components

Austria . 1,977 parts In-Stock

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Perfect Parts

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UHIMA Technologies

Türkiye . 677 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Overview

Discover the power of the FQP6N60C from Onsemi, a high-quality N-channel Power Field Effect Transistor (FET) that delivers exceptional performance in switching applications. With a maximum pulsing drain current of 22A and a minimum breakdown voltage of 600V, this transistor is designed to handle your toughest tasks with ease. Whether you're working on industrial machinery, automotive electronics, or renewable energy systems, the FQP6N60C offers reliable and efficient operation every time. Trust in Onsemi's reputation for excellence and unlock the full potential of your projects with this versatile component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the FET, ensuring it can withstand various environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower ON resistance and faster switching speeds compared to P-channel FETs, making them ideal for high-performance applications.

Minimum DS Breakdown Voltage: 600 V

The high breakdown voltage of 600V allows for the FET to handle higher voltage applications, making it versatile and reliable.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are normally off devices that require a positive voltage on the gate to turn on, offering better control and efficiency in switching applications.

Maximum Pulsed Drain Current (IDM): 22 A

With a high pulsed drain current rating of 22A, this FET can handle large peak currents without damage, making it suitable for demanding applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor FETs offer good performance and reliability, making them a popular choice for power switching applications.

Maximum Operating Temperature: 150 °C

The FET's maximum operating temperature of 150 °C allows it to operate in high-temperature environments without compromising performance or reliability.

Maximum Drain Current (ID): 5.5 A

The FET's maximum drain current rating of 5.5A ensures it can handle continuous current flow without overheating, making it a suitable choice for various applications.

Maximum Drain-Source On Resistance: 2 ohm

With a low drain-source on resistance of 2 ohms, the FET minimizes power loss and heat dissipation, improving efficiency in power switching applications.

Technical Specifications

Power Field Effect Transistors (FET) FQP6N60C attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

FAST SWITCHING

Avalanche Energy Rating (EAS):

300 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

5.5 A

Maximum Drain-Source On Resistance:

2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

22 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQP6N60C Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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