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FQP3N60C

Onsemi

FQP3N60C by Onsemi

FQP3N60C by Onsemi is a power field effect transistor (FET) with a min DS breakdown voltage of 600V. It is an N-channel transistor with a max pulsed drain current of 12A, making it suitable for switching applications. Its package style is flange mount and it operates in enhancement mode.

Median Price

$0.650

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 7 parts In-Stock

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$0.422

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$0.422

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Rochester

USA . 3,304 parts In-Stock

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$0.650

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$0.611

1k+ parts

$0.552

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3,304

$0.650

$0.611

$0.552

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Chip1Stop

Japan . 7 parts In-Stock

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$0.715

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7

$0.715

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DigiKey

USA . 9,772 parts In-Stock

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$2.030

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$0.875

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$0.637

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$0.535

9,772

$2.030

$0.875

$0.637

$0.535

Future Electronics

Canada . 1,950 parts In-Stock

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$0.540

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$0.500

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Farnell

UK . 1,183 parts In-Stock

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$0.651

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Distributors (In-Stock)

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Digiode

USA . 1,033 parts In-Stock

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$0.401

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$0.401

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Nova Conductors

Japan . 870 parts In-Stock

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$0.607

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$0.607

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Vyrian

USA . 2,230 parts In-Stock

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2,230

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Schukat

Germany . 270 parts In-Stock

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$0.477

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$0.412

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270

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$0.477

$0.412

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Bristol Electronics

USA . 212 parts In-Stock

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$0.352

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ComSIT Distribution GmbH

Germany . 100 parts In-Stock

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ComSIT USA

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,440 parts In-Stock

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$0.359

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2,440

$0.359

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Corphita

USA . 2,301 parts In-Stock

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$0.380

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$0.380

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Corohmni

South Africa . 198 parts In-Stock

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$0.422

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198

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Aranea Global

USA . 2,000 parts In-Stock

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$0.595

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$0.571

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2,000

$0.595

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$0.571

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Argo Parts USA

USA . 487 parts In-Stock

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$0.607

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$0.589

487

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$0.589

Microchip USA

USA . 9,620 parts In-Stock

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$9.100

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$9.100

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Metaverse IC Inc.

Canada . 50,000 parts In-Stock

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Perfect Parts

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QUARKTWIN TECHNOLOGY LTD

USA . 20,322 parts In-Stock

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Infinite Electronics LLP (Excess)

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TANS Electronics

Latvia . 5,217 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,174 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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SupplyDigital Components

Austria . 4,530 parts In-Stock

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Problanco Electronics

Mexico . 4,108 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,449 parts In-Stock

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Continental Prestige Electronics

USA . 3,304 parts In-Stock

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Supply Digital

USA . 2,058 parts In-Stock

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Kulean Microsystems

USA . 1,400 parts In-Stock

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Lixinc

USA . 1,318 parts In-Stock

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Kepictronics

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UHIMA Technologies

Türkiye . 268 parts In-Stock

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Overview

Discover the FQP3N60C by Onsemi, a high-quality Power Field Effect Transistor (FET) designed for switching applications. With a minimum DS breakdown voltage of 600V and maximum drain current of 3A, this N-channel transistor offers exceptional performance and reliability. Its single configuration with built-in diode ensures easy integration into your system. The FQP3N60C is perfect for various applications, delivering efficient power management. Trust Onsemi, a renowned manufacturer known for their superior products. Experience the value and benefits of the FQP3N60C today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL

Allows for versatile applications in circuits requiring N-channel FETs.

Minimum DS Breakdown Voltage: 600 V

Can handle high voltage applications with a breakdown voltage of 600 V.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient performance.

Maximum Pulsed Drain Current (IDM): 12 A

Capable of handling high pulsed current loads for reliable operation.

Avalanche Energy Rating (EAS): 150 mJ

Provides protection against avalanche breakdown events.

Maximum Drain-Source On Resistance: 3.4 ohm

Low on-resistance allows for efficient power handling and minimal power loss.

Technical Specifications

Power Field Effect Transistors (FET) FQP3N60C attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

150 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

3 A

Maximum Drain Current (ID):

3 A

Maximum Drain-Source On Resistance:

3.4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

12 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQP3N60C Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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