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FQP3N30

Onsemi

FQP3N30 by Onsemi

FQP3N30 by Onsemi is a N-CHANNEL Power FET with 300V DS Breakdown Voltage, ideal for SWITCHING applications. It features 12.8A Max Pulsed Drain Current and 140mJ Avalanche Energy Rating, operating in ENHANCEMENT MODE. With a max power dissipation of 55W and an operating temperature up to 150 °C, it offers reliable performance in various electronic systems.

Median Price

$1.345

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 3,155 parts In-Stock

1+ parts

$1.230

100+ parts

$0.742

1k+ parts

$0.613

10k+ parts

-

3,155

$1.230

$0.742

$0.613

-

Newark

USA . 2 parts In-Stock

1+ parts

$1.460

100+ parts

$1.020

1k+ parts

$0.830

10k+ parts

$0.690

2

$1.460

$1.020

$0.830

$0.690

Element14

Singapore . 448 parts In-Stock

1+ parts

$1.870

100+ parts

-

1k+ parts

-

10k+ parts

-

448

$1.870

-

-

-

Adafruit Industries

USA . 50 parts In-Stock

1+ parts

$1.943

100+ parts

$1.924

1k+ parts

-

10k+ parts

-

50

$1.943

$1.924

-

-

Rochester

USA . 37,564 parts In-Stock

1+ parts

-

100+ parts

$0.693

1k+ parts

$0.575

10k+ parts

$0.513

37,564

-

$0.693

$0.575

$0.513

Verical

USA . 28,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.719

10k+ parts

$0.641

28,200

-

-

$0.719

$0.641

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,493 parts In-Stock

1+ parts

$0.541

100+ parts

-

1k+ parts

-

10k+ parts

-

1,493

$0.541

-

-

-

Vyrian

USA . 2,554 parts In-Stock

1+ parts

$0.569

100+ parts

-

1k+ parts

-

10k+ parts

-

2,554

$0.569

-

-

-

Flip Electronics

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

LittleDiode

UK . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 29 parts In-Stock

1+ parts

$0.205

100+ parts

-

1k+ parts

-

10k+ parts

$0.196

29

$0.205

-

-

$0.196

Northwest PG Solutions

USA . 1,883 parts In-Stock

1+ parts

$0.225

100+ parts

-

1k+ parts

-

10k+ parts

$0.198

1,883

$0.225

-

-

$0.198

Corphita

USA . 1,307 parts In-Stock

1+ parts

$0.512

100+ parts

-

1k+ parts

-

10k+ parts

-

1,307

$0.512

-

-

-

Corohmni

South Africa . 131 parts In-Stock

1+ parts

$0.569

100+ parts

-

1k+ parts

-

10k+ parts

-

131

$0.569

-

-

-

Continental Prestige Electronics

USA . 448 parts In-Stock

1+ parts

$1.230

100+ parts

$0.742

1k+ parts

-

10k+ parts

-

448

$1.230

$0.742

-

-

Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$1.943

100+ parts

$1.924

1k+ parts

$1.846

10k+ parts

-

50

$1.943

$1.924

$1.846

-

Andel Nordic

Denmark . 500 parts In-Stock

1+ parts

$8.732

100+ parts

-

1k+ parts

$8.383

10k+ parts

$8.383

500

$8.732

-

$8.383

$8.383

Perfect Parts

USA . 10,644 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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10,644

-

-

-

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A-Z Elektronik GmbH

Germany . 5,915 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

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5,915

-

-

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Alle Elektronik GmbH

Germany . 3,943 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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3,943

-

-

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Supply Digital

USA . 2,614 parts In-Stock

1+ parts

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100+ parts

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2,614

-

-

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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-

10k+ parts

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2,000

-

-

-

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Problanco Electronics

Mexico . 1,560 parts In-Stock

1+ parts

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1,560

-

-

-

-

Kulean Microsystems

USA . 1,261 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,261

-

-

-

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SupplyDigital Components

Austria . 971 parts In-Stock

1+ parts

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1k+ parts

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971

-

-

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TANS Electronics

Latvia . 806 parts In-Stock

1+ parts

-

100+ parts

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806

-

-

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UHIMA Technologies

Türkiye . 417 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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417

-

-

-

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Microchip USA

USA . 348 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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348

-

-

-

-

Overview

Elevate your power management with the FQP3N30 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their Power Field Effect Transistors (FET). This N-CHANNEL transistor is designed for switching applications, providing enhanced performance and efficiency. With a maximum drain current of 3.2A and a minimum breakdown voltage of 300V, this transistor offers exceptional value and benefits to customers looking for high-quality components. Upgrade your electronic systems with the FQP3N30 and experience the advantage of Onsemi's superior technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protection for the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL

Allows for efficient switching and control of current flow.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and allows for easier integration in various applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in such scenarios.

Minimum DS Breakdown Voltage: 300 V

Capable of handling high voltages, making it suitable for a wide range of power applications.

Maximum Pulsed Drain Current (IDM): 12.8 A

Can handle high current pulses, suitable for applications requiring quick bursts of power.

Maximum Power Dissipation (Abs): 55 W

Can dissipate high amounts of power without overheating, ensuring reliability under heavy loads.

Maximum Operating Temperature: 150 °C

Capable of operating in high-temperature environments, providing versatility in usage.

Technical Specifications

Power Field Effect Transistors (FET) FQP3N30 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

140 mJ

Minimum DS Breakdown Voltage:

300 V

Maximum Drain Current (Abs) (ID):

3.2 A

Maximum Drain Current (ID):

3.2 A

Maximum Drain-Source On Resistance:

2.2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

12.8 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQP3N30 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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