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FQP3P20

Onsemi

FQP3P20 by Onsemi

The Onsemi FQP3P20 is a P-CHANNEL Power FET with 200V DS Breakdown Voltage, ideal for SWITCHING applications. It features 11.2A Max IDM, 150mJ EAS, and 2.7 ohm RDS(ON). The transistor operates in ENHANCEMENT MODE with a max power dissipation of 52W at up to 150°C temperature.

Median Price

$0.719

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,565 parts In-Stock

1+ parts

$0.596

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1,565

$0.596

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Rochester

USA . 7 parts In-Stock

1+ parts

$0.719

100+ parts

$0.676

1k+ parts

$0.611

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7

$0.719

$0.676

$0.611

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Adafruit Industries

USA . 50 parts In-Stock

1+ parts

$1.133

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$1.122

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50

$1.133

$1.122

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Verical

USA . 1,565 parts In-Stock

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1,565

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Digiode

USA . 2,570 parts In-Stock

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$0.566

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2,570

$0.566

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Nova Conductors

Japan . 43 parts In-Stock

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$0.718

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43

$0.718

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Chip Stock

USA . 6,370 parts In-Stock

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6,370

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Pegasus Components GmbH

Germany . 2,150 parts In-Stock

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Vyrian

USA . 700 parts In-Stock

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700

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Inventory MP

USA . 10 parts In-Stock

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10

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Bristol Electronics

USA . 10 parts In-Stock

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10

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Distributors (Availability)

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Ampacity Inc.

Singapore . 536 parts In-Stock

1+ parts

$0.510

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536

$0.510

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Corphita

USA . 950 parts In-Stock

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$0.536

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950

$0.536

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Corohmni

South Africa . 353 parts In-Stock

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$0.596

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353

$0.596

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Argo Parts USA

USA . 3,322 parts In-Stock

1+ parts

$0.718

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$0.697

3,322

$0.718

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$0.697

Continental Prestige Electronics

USA . 3,226 parts In-Stock

1+ parts

$0.718

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$0.704

3,226

$0.718

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$0.704

Netroflash

USA . 100 parts In-Stock

1+ parts

$0.718

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$0.704

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100

$0.718

$0.704

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$1.133

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$1.122

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$1.077

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50

$1.133

$1.122

$1.077

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Lixinc

USA . 18,468 parts In-Stock

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Kepictronics

USA . 14,000 parts In-Stock

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Problanco Electronics

Mexico . 8,029 parts In-Stock

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TANS Electronics

Latvia . 7,762 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,401 parts In-Stock

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Microchip USA

USA . 7,281 parts In-Stock

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Kulean Microsystems

USA . 6,548 parts In-Stock

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SupplyDigital Components

Austria . 5,631 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,934 parts In-Stock

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Perfect Parts

USA . 4,196 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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Supply Digital

USA . 2,787 parts In-Stock

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S.R.D Solutions

India . 1,000 parts In-Stock

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iodParts Technologies Inc.

India . 850 parts In-Stock

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850

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Authorized Procurement Solutions

USA . 350 parts In-Stock

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350

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UHIMA Technologies

Türkiye . 175 parts In-Stock

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Overview

Unleash the power of the Onsemi FQP3P20 Power Field Effect Transistor! Designed for switching applications, this P-Channel transistor offers a breakthrough in performance and reliability. With a high DS breakdown voltage of 200V and an impressive maximum power dissipation of 52W, this single configuration transistor is a game-changer in the industry. The built-in diode and enhanced mode operation make it versatile for a wide range of applications. Trust in Onsemi's reputation for quality and innovation, and experience the value and benefits this transistor brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durable and reliable housing for the transistor, ensuring longevity and protection from external elements.

Polarity or Channel Type: P-CHANNEL

Allows for efficient current flow and control in the circuit, enhancing overall performance.

Minimum DS Breakdown Voltage: 200 V

Can handle high voltage applications with ease, ensuring safety and stability.

Transistor Application: SWITCHING

Ideal for switching applications, making it suitable for use in various electronic devices.

Maximum Pulsed Drain Current (IDM): 11.2 A

Capable of handling high current pulses, making it versatile for different operating conditions.

Maximum Power Dissipation (Abs): 52 W

Can dissipate power efficiently without overheating, ensuring reliable operation.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without impacting performance, suitable for industrial applications.

Technical Specifications

Power Field Effect Transistors (FET) FQP3P20 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

150 mJ

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

2.8 A

Maximum Drain Current (ID):

2.8 A

Maximum Drain-Source On Resistance:

2.7 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

11.2 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQP3P20 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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