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FDPF5N60NZ

Onsemi

FDPF5N60NZ by Onsemi

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): 33 W; Transistor Element Material: SILICON; Qualification: Not Qualified;

Median Price

$0.952

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,000 parts In-Stock

1+ parts

$1.539

100+ parts

$1.099

1k+ parts

$0.897

10k+ parts

-

2,000

$1.539

$1.099

$0.897

-

Farnell

UK . 4,031 parts In-Stock

1+ parts

-

100+ parts

$0.778

1k+ parts

$0.526

10k+ parts

$0.506

4,031

-

$0.778

$0.526

$0.506

Rochester

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

$0.935

1k+ parts

$0.776

10k+ parts

$0.692

2,500

-

$0.935

$0.776

$0.692

Verical

USA . 2,500 parts In-Stock

1+ parts

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100+ parts

-

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$0.970

10k+ parts

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2,500

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-

$0.970

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Distributors (In-Stock)

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Digiode

USA . 2,819 parts In-Stock

1+ parts

$0.765

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2,819

$0.765

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Vyrian

USA . 805 parts In-Stock

1+ parts

$0.778

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805

$0.778

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ComSIT Distribution GmbH

Germany . 2,000 parts In-Stock

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2,000

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Flip Electronics

USA . 897 parts In-Stock

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897

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Distributors (Availability)

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Corphita

USA . 881 parts In-Stock

1+ parts

$0.724

100+ parts

-

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881

$0.724

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Corohmni

South Africa . 60 parts In-Stock

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$0.778

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60

$0.778

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Continental Prestige Electronics

USA . 1,000 parts In-Stock

1+ parts

$1.080

100+ parts

$0.778

1k+ parts

$0.526

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-

1,000

$1.080

$0.778

$0.526

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Andel Nordic

Denmark . 2,272 parts In-Stock

1+ parts

$8.240

100+ parts

-

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$7.911

10k+ parts

$7.911

2,272

$8.240

-

$7.911

$7.911

Microchip USA

USA . 114 parts In-Stock

1+ parts

$10.075

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114

$10.075

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RC Electronics

USA . 60,826 parts In-Stock

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$0.850

1k+ parts

$0.770

10k+ parts

$0.750

60,826

-

$0.850

$0.770

$0.750

Problanco Electronics

Mexico . 5,659 parts In-Stock

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5,659

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Kepictronics

USA . 5,000 parts In-Stock

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Perfect Parts

USA . 3,483 parts In-Stock

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Northwest PG Solutions

USA . 2,266 parts In-Stock

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2,266

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Supply Digital

USA . 1,366 parts In-Stock

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1,366

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TANS Electronics

Latvia . 1,032 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Kulean Microsystems

USA . 971 parts In-Stock

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971

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UHIMA Technologies

Türkiye . 953 parts In-Stock

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953

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Native Components

USA . 487 parts In-Stock

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487

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SupplyDigital Components

Austria . 80 parts In-Stock

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80

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Technical Specifications

Power Field Effect Transistors (FET) FDPF5N60NZ attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

175 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

4.5 A

Maximum Drain Current (ID):

4.5 A

Maximum Drain-Source On Resistance:

2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

18 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDPF5N60NZ Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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