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FQA11N90-F109

Onsemi

FQA11N90-F109 by Onsemi

FQA11N90-F109 by Onsemi is a N-CHANNEL Power FET with 900V DS Breakdown Voltage and 45.6A Pulsed Drain Current, ideal for SWITCHING applications. Featuring a built-in diode, it has 0.96 ohm Drain-Source On Resistance and operates in ENHANCEMENT MODE up to 150°C.

Median Price

$2.810

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 450 parts In-Stock

1+ parts

$2.810

100+ parts

$2.750

1k+ parts

$2.700

10k+ parts

-

450

$2.810

$2.750

$2.700

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 719 parts In-Stock

1+ parts

$1.900

100+ parts

-

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719

$1.900

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Nova Conductors

Japan . 660 parts In-Stock

1+ parts

$2.699

100+ parts

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660

$2.699

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Maritex

Poland . 300 parts In-Stock

1+ parts

$7.649

100+ parts

$4.616

1k+ parts

$3.897

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300

$7.649

$4.616

$3.897

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Vyrian

USA . 4,434 parts In-Stock

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4,434

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 3,865 parts In-Stock

1+ parts

$1.476

100+ parts

-

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3,865

$1.476

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Modulus Dynamics

Lithuania . 21,072 parts In-Stock

1+ parts

$1.678

100+ parts

$1.678

1k+ parts

$1.678

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-

21,072

$1.678

$1.678

$1.678

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Ampacity Inc.

Singapore . 44 parts In-Stock

1+ parts

$1.700

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-

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44

$1.700

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Corphita

USA . 2,124 parts In-Stock

1+ parts

$1.800

100+ parts

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2,124

$1.800

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Corohmni

South Africa . 209 parts In-Stock

1+ parts

$2.000

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209

$2.000

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$2.645

100+ parts

-

1k+ parts

$2.539

10k+ parts

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100

$2.645

-

$2.539

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Continental Prestige Electronics

USA . 4,188 parts In-Stock

1+ parts

$2.699

100+ parts

-

1k+ parts

-

10k+ parts

$2.645

4,188

$2.699

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-

$2.645

Argo Parts USA

USA . 4,028 parts In-Stock

1+ parts

$2.699

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4,028

$2.699

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$2.699

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1,000

$2.699

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Andel Nordic

Denmark . 4,227 parts In-Stock

1+ parts

$4.562

100+ parts

-

1k+ parts

$4.380

10k+ parts

$4.380

4,227

$4.562

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$4.380

$4.380

AZTECH Wire

Italy . 525 parts In-Stock

1+ parts

$16.746

100+ parts

-

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525

$16.746

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A-Z Elektronik GmbH

Germany . 7,478 parts In-Stock

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7,478

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Lixinc

USA . 7,282 parts In-Stock

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7,282

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Problanco Electronics

Mexico . 7,114 parts In-Stock

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7,114

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TANS Electronics

Latvia . 6,571 parts In-Stock

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6,571

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Kulean Microsystems

USA . 2,847 parts In-Stock

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2,847

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Kepictronics

USA . 2,500 parts In-Stock

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2,500

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SupplyDigital Components

Austria . 2,105 parts In-Stock

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2,105

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Alle Elektronik GmbH

Germany . 1,085 parts In-Stock

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1,085

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Supply Digital

USA . 1,025 parts In-Stock

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1,025

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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UHIMA Technologies

Türkiye . 640 parts In-Stock

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640

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Overview

Onsemi's FQA11N90-F109 is a game-changer in the world of Power FETs, offering unparalleled quality and reliability. Manufactured by Onsemi, a trusted name in the industry, this N-CHANNEL transistor with a built-in diode is perfect for switching applications. With a minimum DS Breakdown Voltage of 900V and a Maximum Power Dissipation of 300W, this FET delivers outstanding performance and efficiency. Whether you're designing power supplies, motor controls, or lighting systems, the FQA11N90-F109 provides the value, benefits, and advantages that customers crave. Trust Onsemi to deliver excellence in every component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs tend to have better performance and lower resistance compared to P-channel FETs, making this transistor a high-performance option.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and improves efficiency, making this transistor a convenient choice for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast response times and reliable performance in high-speed circuits.

Minimum DS Breakdown Voltage: 900 V

The high breakdown voltage ensures that this transistor can handle high voltage applications, making it suitable for industrial and power electronics.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and space-saving design, making this transistor versatile for various board layouts.

Terminal Form: THROUGH-HOLE

The through-hole terminals provide secure connections and ease of soldering, ensuring reliable performance in demanding environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for easier control and better efficiency in switching applications, enhancing overall performance.

Maximum Pulsed Drain Current (IDM): 45.6 A

The high pulsed current rating allows for handling of short-duration high current spikes, making this transistor suitable for pulse applications.

Avalanche Energy Rating (EAS): 1000 mJ

The high avalanche energy rating ensures reliable performance under high-energy transients, making this transistor robust in harsh operating conditions.

Maximum Drain Current (Abs) (ID): 11.4 A

The high drain current rating allows for handling of continuous high current loads, making this transistor suitable for power applications.

No. of Terminals: 3

With three terminals for easy connectivity, this transistor is easy to integrate into various circuit designs, offering flexibility in application.

Maximum Power Dissipation (Abs): 300 W

The high power dissipation rating allows for efficient heat dissipation, ensuring stable operation even under high power conditions.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides mechanical stability and easy mounting, making this transistor suitable for rugged environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high efficiency and fast switching speeds, making this transistor ideal for high-performance applications.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this transistor can withstand elevated temperatures, making it suitable for demanding environments.

Transistor Element Material: SILICON

Silicon material offers high reliability and performance consistency, ensuring long-term stability and durability of this transistor.

Maximum Drain-Source On Resistance: 0.96 ohm

The low on-resistance minimizes power loss and improves efficiency, making this transistor suitable for high-power applications.

Terminal Position: SINGLE

The single terminal position simplifies circuit design and reduces complexity, making this transistor easy to integrate into various applications.

Technical Specifications

Power Field Effect Transistors (FET) FQA11N90-F109 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1000 mJ

Minimum DS Breakdown Voltage:

900 V

Maximum Drain Current (Abs) (ID):

11.4 A

Maximum Drain Current (ID):

11.4 A

Maximum Drain-Source On Resistance:

.96 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

45.6 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQA11N90-F109 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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