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FQA140N10

Onsemi

FQA140N10 by Onsemi

FQA140N10 by Onsemi is a N-CHANNEL Power FET with 100V DS Breakdown Voltage, ideal for SWITCHING applications. It features a Max Drain Current of 140A, Max Pulsed Drain Current of 560A, and an Operating Temperature up to 175 °C. The transistor comes in a RECTANGULAR package with THROUGH-HOLE terminals and has an ON Resistance of 0.01 ohm.

Median Price

$4.400

Lifecycle Status

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14

In-Stock Inventory

1k+

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DigiKey

USA . 890 parts In-Stock

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$8.170

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$4.750

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$3.523

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890

$8.170

$4.750

$3.523

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Rochester

USA . 337 parts In-Stock

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-

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$3.520

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$3.150

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$2.970

337

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$3.520

$3.150

$2.970

Verical

USA . 285 parts In-Stock

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-

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$4.400

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$3.938

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$3.712

285

-

$4.400

$3.938

$3.712

Distributors (In-Stock)

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Digiode

USA . 770 parts In-Stock

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$3.714

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$3.714

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Vyrian

USA . 3,181 parts In-Stock

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$3.910

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$3.910

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TME

Poland . 12 parts In-Stock

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$7.790

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$4.910

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12

$7.790

$4.910

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Chip Stock

USA . 6,152 parts In-Stock

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R&J Components

USA . 2,990 parts In-Stock

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2,990

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Sensible Micro Corp

USA . 2,262 parts In-Stock

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Flip Electronics

USA . 330 parts In-Stock

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Prism Electronics

USA . 270 parts In-Stock

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NAC Semi

USA . 210 parts In-Stock

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$17.680

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$16.320

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210

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$16.320

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ComSIT Distribution GmbH

Germany . 36 parts In-Stock

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North Shore Components

USA . 19 parts In-Stock

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Ampacity Inc.

Singapore . 148 parts In-Stock

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$3.320

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$3.320

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Corphita

USA . 828 parts In-Stock

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$3.519

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$3.519

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Corohmni

South Africa . 434 parts In-Stock

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$3.910

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434

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Microchip USA

USA . 5,044 parts In-Stock

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$19.908

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Perfect Parts

USA . 89,672 parts In-Stock

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iodParts Technologies Inc.

India . 50,000 parts In-Stock

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Kulean Microsystems

USA . 6,427 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,850 parts In-Stock

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Problanco Electronics

Mexico . 3,081 parts In-Stock

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TANS Electronics

Latvia . 2,503 parts In-Stock

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SupplyDigital Components

Austria . 1,768 parts In-Stock

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S.R.D Solutions

India . 1,642 parts In-Stock

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Supply Digital

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UHIMA Technologies

Türkiye . 489 parts In-Stock

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Kepictronics

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Native Components

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Northwest PG Solutions

USA . 8 parts In-Stock

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Overview

Unlock the power of innovation with the FQA140N10 from Onsemi, a leading manufacturer in the industry. This Power Field Effect Transistor (FET) offers unparalleled quality and reliability for switching applications. With a maximum pulsing drain current of 560A and a minimum DS breakdown voltage of 100V, this N-channel transistor is designed to deliver exceptional performance. Whether you're looking to enhance your electronic projects or streamline your operations, the FQA140N10 provides the value, benefits, and advantages you need to succeed. Experience the difference with Onsemi's cutting-edge technology and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the FET suitable for various environmental conditions.

Polarity or Channel Type: N-CHANNEL

Allows for efficient current flow and control in the desired direction.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplified design with built-in diode for reverse current protection, saving space and reducing component count.

Transistor Application: SWITCHING

Designed for high-speed switching applications, ideal for controlling power flow in electronic circuits.

Minimum DS Breakdown Voltage: 100 V

Can handle high voltage levels, offering reliable performance in demanding applications.

Package Shape: RECTANGULAR

Easily integrated into circuit boards for compact and efficient designs.

Maximum Pulsed Drain Current (IDM): 560 A

Capable of handling high current pulses, suitable for power-intensive tasks.

Avalanche Energy Rating (EAS): 1500 mJ

Withstands high energy spikes and surges, ensuring robustness under transient conditions.

Maximum Drain Current (Abs) (ID): 140 A

Provides high current-carrying capability for demanding operational requirements.

Maximum Power Dissipation (Abs): 375 W

Efficiently dissipates heat generated during operation, preventing overheating and ensuring reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Uses advanced MOSFET technology for efficient power management and low conduction losses.

Maximum Operating Temperature: 175 °C

Can operate at high temperatures without compromising performance, suitable for industrial applications.

Terminal Finish: Matte Tin (Sn) - annealed

Provides corrosion resistance and reliable electrical connections for long-term usage.

Maximum Drain-Source On Resistance: 0.01 ohm

Low on-resistance minimizes power loss and enhances efficiency in power electronics applications.

Technical Specifications

Power Field Effect Transistors (FET) FQA140N10 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1500 mJ

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

140 A

Maximum Drain Current (ID):

140 A

Maximum Drain-Source On Resistance:

.01 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

560 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQA140N10 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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