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FQA170N06

Onsemi

FQA170N06 by Onsemi

FQA170N06 by Onsemi is a N-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 680A IDM, 990mJ EAS, and 0.0056 ohm RDS(ON). The transistor operates in ENHANCEMENT MODE with a max power dissipation of 375W at 175 °C.

Median Price

$6.158

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1 parts In-Stock

1+ parts

$7.390

100+ parts

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1

$7.390

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Farnell

UK . 250 parts In-Stock

1+ parts

$7.420

100+ parts

$6.410

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250

$7.420

$6.410

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Rochester

USA . 250 parts In-Stock

1+ parts

-

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$3.940

1k+ parts

$3.530

10k+ parts

$3.320

250

-

$3.940

$3.530

$3.320

Verical

USA . 250 parts In-Stock

1+ parts

-

100+ parts

$4.925

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$4.412

10k+ parts

$4.150

250

-

$4.925

$4.412

$4.150

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,914 parts In-Stock

1+ parts

$4.380

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2,914

$4.380

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Vyrian

USA . 8,795 parts In-Stock

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8,795

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R&J Components

USA . 324 parts In-Stock

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324

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Component Electronics Inc.

Canada . 93 parts In-Stock

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93

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Sunrise Surplus Inc.

USA . 32 parts In-Stock

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32

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Distributors (Availability)

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Ampacity Inc.

Singapore . 141 parts In-Stock

1+ parts

$3.920

100+ parts

-

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141

$3.920

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Corphita

USA . 2,569 parts In-Stock

1+ parts

$4.149

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2,569

$4.149

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Corohmni

South Africa . 371 parts In-Stock

1+ parts

$4.610

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371

$4.610

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Continental Prestige Electronics

USA . 250 parts In-Stock

1+ parts

$7.420

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$7.420

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Microchip USA

USA . 7,048 parts In-Stock

1+ parts

$20.048

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7,048

$20.048

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A-Z Elektronik GmbH

Germany . 7,574 parts In-Stock

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7,574

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SupplyDigital Components

Austria . 5,812 parts In-Stock

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Kulean Microsystems

USA . 5,157 parts In-Stock

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TANS Electronics

Latvia . 4,572 parts In-Stock

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Problanco Electronics

Mexico . 2,790 parts In-Stock

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2,790

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Supply Digital

USA . 1,785 parts In-Stock

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1,785

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Perfect Parts

USA . 1,512 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,149 parts In-Stock

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1,149

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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UHIMA Technologies

Türkiye . 512 parts In-Stock

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512

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Northwest PG Solutions

USA . 473 parts In-Stock

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$4.106

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473

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$4.106

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Kepictronics

USA . 450 parts In-Stock

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450

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Native Components

USA . 280 parts In-Stock

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$4.064

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280

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$4.064

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Overview

Maximize the efficiency of your power applications with the FQA170N06 by Onsemi. Crafted with precision and quality in mind, this N-CHANNEL Power Field Effect Transistor offers superior performance and reliability for all your switching needs. With a maximum drain current of 170A and a low on-resistance of 0.0056 ohm, this transistor provides exceptional value and benefits to customers seeking high-power solutions. Trust in Onsemi's expertise in semiconductor technology and elevate your projects with the FQA170N06 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation properties and can withstand high temperatures, making the product reliable and durable.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower ON-resistance and higher efficiency compared to P-channel FETs, making them suitable for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the transistor from back EMF, enhancing overall efficiency and reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low power dissipation, making it ideal for power management.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this FET can handle larger voltages without breakdown, ensuring safety and reliability in high voltage applications.

Maximum Pulsed Drain Current (IDM): 680 A

The high pulsed drain current rating allows the FET to handle short-term high current surges without overheating or damage, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 375 W

The high power dissipation rating ensures that the FET can safely handle high power loads and operate efficiently without overheating.

Maximum Operating Temperature: 175 °C

The high operating temperature range allows the FET to operate in a wide range of environments without performance degradation, increasing its versatility.

Technical Specifications

Power Field Effect Transistors (FET) FQA170N06 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

990 mJ

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

170 A

Maximum Drain Current (ID):

170 A

Maximum Drain-Source On Resistance:

.0056 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

680 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQA170N06 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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