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FNF51560TD2

Onsemi

FNF51560TD2 by Onsemi

FNF51560TD2 by Onsemi is a Motion Control IC with 20 terminals, 15A max output current, and 16.5V max supply voltage. It is ideal for AC motor control applications due to its hybrid technology and compact rectangular package design measuring 37mm x 21mm x 6mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,233 parts In-Stock

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Vyrian

USA . 260 parts In-Stock

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Kulean Microsystems

USA . 8,183 parts In-Stock

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Problanco Electronics

Mexico . 3,817 parts In-Stock

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SupplyDigital Components

Austria . 2,702 parts In-Stock

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TANS Electronics

Latvia . 1,997 parts In-Stock

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Northwest PG Solutions

USA . 1,245 parts In-Stock

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Corphita

USA . 1,144 parts In-Stock

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UHIMA Technologies

Türkiye . 720 parts In-Stock

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Corohmni

South Africa . 409 parts In-Stock

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Native Components

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Overview

Experience seamless and precise motion control with the FNF51560TD2 by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their products. The FNF51560TD2 falls under the category of Motion Control ICs, making it ideal for various applications requiring efficient motor control. With a nominal supply voltage of 15V and a maximum output current of 15A, this AC motor controller offers unparalleled performance and versatility. Trust Onsemi to provide you with cutting-edge technology that meets your needs with ease.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular shape allows for efficient utilization of space in the design of the product.

Nominal Supply Voltage (Vsup): 15 V

Optimal supply voltage ensures stable and reliable performance of the motion control IC.

No. of Terminals: 20

Sufficient number of terminals for connecting the IC to various components in the application.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

Microelectronic assembly ensures high precision and compact size of the IC.

Terminal Position: DUAL

Dual terminal position allows for flexibility in connecting the IC in different configurations.

Maximum Seated Height: 6 mm

Low seated height enables the IC to be easily integrated into tight spaces in the system design.

Width (mm): 21 mm

Compact width of the IC facilitates easy integration into the overall system layout.

Other IC type: AC MOTOR CONTROLLER

Specifically designed for controlling AC motors, making it suitable for motor control applications.

Minimum Supply Voltage (Vsup): 14 V

Wide range of supply voltage allows for compatibility with different power sources.

Length: 37 mm

Moderate length of the IC offers a balance between compact size and functional components.

Maximum Supply Current (Isup): 2.5 mA

Low supply current requirement helps in reducing power consumption and heat generation.

Maximum Output Current: 15 A

High output current capacity enables the IC to drive powerful motors effectively.

Technology: HYBRID

Hybrid technology combines the benefits of different technologies for optimal performance and efficiency.

Terminal Form: THROUGH-HOLE

Through-hole terminals allow for secure and durable connections in the system.

Maximum Supply Voltage (Vsup): 16.5 V

Slightly higher maximum supply voltage provides an extra margin for voltage fluctuations in the system.

Technical Specifications

Motion Control ICs FNF51560TD2 attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-XDMA-T20

Length:

37 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Output Current:

15 A

Package Body Material:

UNSPECIFIED

Package Code:

DMA

Package Equivalence Code:

MODULE,20LEAD,1.0

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

6 mm

Maximum Supply Current (Isup):

2.5 mA

Maximum Supply Voltage (Vsup):

16.5 V

Minimum Supply Voltage (Vsup):

14 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Technology:

HYBRID

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Width (mm):

21 mm

Trade Compliance

FNF51560TD2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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