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FNF51060TD2

Onsemi

FNF51060TD2 by Onsemi

FNF51060TD2 by Onsemi is a Motion Control IC with 20 terminals, 15V nominal voltage, and 10A max output current. It is ideal for AC motor control applications due to its hybrid technology and compact rectangular package design (37mm x 21mm x 6mm).

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,635 parts In-Stock

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Vyrian

USA . 89 parts In-Stock

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Native Components

USA . 147 parts In-Stock

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$9.100

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147

$9.100

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Northwest PG Solutions

USA . 315 parts In-Stock

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$10.010

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$9.009

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315

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Problanco Electronics

Mexico . 8,275 parts In-Stock

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Kulean Microsystems

USA . 7,376 parts In-Stock

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TANS Electronics

Latvia . 3,214 parts In-Stock

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Corphita

USA . 1,952 parts In-Stock

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SupplyDigital Components

Austria . 676 parts In-Stock

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Corohmni

South Africa . 264 parts In-Stock

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UHIMA Technologies

Türkiye . 132 parts In-Stock

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Overview

Experience seamless motion control like never before with the FNF51060TD2 by Onsemi. Crafted with precision and reliability, this AC motor controller offers unparalleled performance in a compact package. Ideal for a wide range of applications, this motion control IC provides smooth and efficient operation for your projects. Trust in Onsemi's expertise to deliver quality products that exceed expectations. Upgrade your systems today with the FNF51060TD2 and enjoy the benefits of advanced technology at your fingertips.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular shape typically allows for efficient use of space on a circuit board, making this product suitable for applications with limited space constraints.

Nominal Supply Voltage (Vsup): 15 V

The ability to operate at a relatively high voltage of 15V provides flexibility in powering the device and enables it to work effectively in a variety of power supply configurations.

No. of Terminals: 20

A higher number of terminals means more connectivity options and functionality, making this product versatile and suitable for complex motion control systems.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

Microelectronic assembly ensures precise and compact packaging, enhancing the overall performance and reliability of the product.

Maximum Seated Height: 6 mm

The compact seated height of 6mm contributes to a low profile design, making this product suitable for applications where space-saving is essential.

Width (mm): 21 mm

The moderate width of 21mm strikes a balance between compactness and accessibility, allowing for easy integration into various electronic systems.

Other IC type: AC MOTOR CONTROLLER

Being an AC motor controller, this product is specifically designed for controlling alternating current motors, making it ideal for motion control applications that require precise motor control.

Minimum Supply Voltage (Vsup): 14 V

The low minimum supply voltage of 14V ensures compatibility with a wide range of power sources and increases the product's versatility in different operating conditions.

Length: 37 mm

The moderate length of 37mm allows for a balanced layout and ensures ease of installation, making this product a convenient choice for various motion control applications.

Maximum Supply Current (Isup): 2.5 mA

The low maximum supply current of 2.5mA indicates efficient power consumption, making this product energy-efficient and suitable for battery-powered devices.

Maximum Output Current: 10 A

With a maximum output current of 10A, this product is capable of driving high-power loads, making it suitable for demanding motion control applications that require high current handling.

Technology: HYBRID

Utilizing hybrid technology ensures a combination of different semiconductor technologies for optimal performance, making this product reliable and efficient in controlling motion.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure and reliable connection, making this product durable and suitable for applications that require robustness in terminal connections.

Maximum Supply Voltage (Vsup): 16.5 V

The high maximum supply voltage of 16.5V allows for operation in higher voltage environments, making this product versatile and suitable for a wide range of industrial and automotive applications.

Technical Specifications

Motion Control ICs FNF51060TD2 attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-XDMA-T20

Length:

37 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Output Current:

10 A

Package Body Material:

UNSPECIFIED

Package Code:

DMA

Package Equivalence Code:

MODULE,20LEAD,1.0

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

6 mm

Maximum Supply Current (Isup):

2.5 mA

Maximum Supply Voltage (Vsup):

16.5 V

Minimum Supply Voltage (Vsup):

14 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Technology:

HYBRID

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Width (mm):

21 mm

Trade Compliance

FNF51060TD2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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