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FNF51060TD3

Onsemi

FNF51060TD3 by Onsemi

FNF51060TD3 by Onsemi is a Motion Control IC with 20 terminals, operating voltage range of 14-16.5V, and max output current of 10A. It is designed for AC motor control applications, featuring a compact rectangular package style measuring 37mm x 21mm x 6mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,692 parts In-Stock

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Vyrian

USA . 1,157 parts In-Stock

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SupplyDigital Components

Austria . 6,952 parts In-Stock

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TANS Electronics

Latvia . 5,532 parts In-Stock

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Problanco Electronics

Mexico . 5,337 parts In-Stock

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Corphita

USA . 1,828 parts In-Stock

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Northwest PG Solutions

USA . 1,425 parts In-Stock

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Native Components

USA . 946 parts In-Stock

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Kulean Microsystems

USA . 666 parts In-Stock

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UHIMA Technologies

Türkiye . 119 parts In-Stock

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Corohmni

South Africa . 66 parts In-Stock

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Overview

Enhance your motion control applications with the FNF51060TD3 by Onsemi, a top-quality AC motor controller designed to deliver precision and efficiency. With Onsemi's reputation for excellence in semiconductor manufacturing, rest assured that this product offers reliability and performance like no other. Perfect for a wide range of motion control tasks, this microelectronic assembly boasts a compact size and low power consumption, making it a valuable asset for your projects. Elevate your systems with the FNF51060TD3 and experience unparalleled control and functionality.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular shape allows for easy installation and fits well in standard electronic setups.

Nominal Supply Voltage (Vsup): 15 V

Optimal supply voltage ensures efficient and stable performance of the motion control IC.

No. of Terminals: 20

Sufficient number of terminals provide flexibility in connection options and versatility in application.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

Microelectronic assembly ensures compact size and efficient heat dissipation for improved reliability.

Terminal Position: DUAL

Dual terminal position allows for easy and secure connections, reducing the chance of loose connections or shorts.

Maximum Seated Height: 6 mm

Low seated height makes it suitable for applications with space constraints or compact designs.

Width (mm): 21 mm

Compact width enables easy integration into electronic systems without taking up too much space.

Other IC type: AC MOTOR CONTROLLER

Designed specifically for controlling AC motors, ensuring compatibility and optimized performance.

Minimum Supply Voltage (Vsup): 14 V

Wide operating voltage range allows for flexibility in power supply options and helps in accommodating different power sources.

Length: 37 mm

Moderate length provides a good balance between compact size and adequate space for components and connections.

Maximum Supply Current (Isup): 2.5 mA

Low supply current consumption helps in reducing power consumption and heat generation, improving efficiency and reliability.

Maximum Output Current: 10 A

High output current capability allows for driving larger loads or multiple devices without the need for additional external components.

Technology: HYBRID

Hybrid technology combines the advantages of different technologies, such as performance and reliability, in a single package.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and reliable connections, suitable for industrial applications or environments with mechanical stress.

Maximum Supply Voltage (Vsup): 16.5 V

High maximum supply voltage tolerance offers protection against voltage spikes or fluctuations, increasing the robustness of the IC.

Technical Specifications

Motion Control ICs FNF51060TD3 attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-XDMA-T20

Length:

37 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Output Current:

10 A

Package Body Material:

UNSPECIFIED

Package Code:

DMA

Package Equivalence Code:

MODULE,20LEAD,1.0

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

6 mm

Maximum Supply Current (Isup):

2.5 mA

Maximum Supply Voltage (Vsup):

16.5 V

Minimum Supply Voltage (Vsup):

14 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Technology:

HYBRID

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Width (mm):

21 mm

Trade Compliance

FNF51060TD3 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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