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FNF50560TD2

Onsemi

FNF50560TD2 by Onsemi

FNF50560TD2 by Onsemi is a Motion Control IC with 20 terminals, operating voltage range of 14-16.5V, and max output current of 5A. Ideal for AC motor control applications due to its compact size (37x21x6mm) and low supply current requirement (2.5mA).

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,465 parts In-Stock

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Vyrian

USA . 333 parts In-Stock

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Native Components

USA . 76 parts In-Stock

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$1.430

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Northwest PG Solutions

USA . 2,216 parts In-Stock

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TANS Electronics

Latvia . 4,212 parts In-Stock

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SupplyDigital Components

Austria . 2,886 parts In-Stock

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Kulean Microsystems

USA . 2,224 parts In-Stock

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Problanco Electronics

Mexico . 806 parts In-Stock

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Corphita

USA . 323 parts In-Stock

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Corohmni

South Africa . 164 parts In-Stock

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UHIMA Technologies

Türkiye . 106 parts In-Stock

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Overview

Experience seamless and efficient motion control with the FNF50560TD2 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality ICs that guarantee reliability and performance. Ideal for applications requiring precise motor control, this AC Motor Controller offers unparalleled value with its advanced technology and user-friendly design. Maximize your system's capabilities and streamline your operations with the FNF50560TD2, the go-to solution for all your motion control needs.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into existing systems and reduces space requirements.

Nominal Supply Voltage (Vsup): 15 V

Optimal supply voltage for efficient functionality and performance.

No. of Terminals: 20

Sufficient number of terminals for connecting to various components and peripherals.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

Microelectronic assembly ensures precision and reliability in manufacturing.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit design and wiring configurations.

Maximum Seated Height: 6 mm

Low seated height allows for compact design and compatibility with tight spaces.

Width (mm): 21 mm

Narrow width saves space and enables mounting in constrained environments.

Other IC type: AC MOTOR CONTROLLER

AC motor controller functionality enhances versatility and applicability for motor control applications.

Minimum Supply Voltage (Vsup): 14 V

Low minimum supply voltage ensures compatibility with a wide range of power sources.

Length: 37 mm

Moderate length provides a balance between compactness and functionality in the design.

Maximum Supply Current (Isup): 2.5 mA

Low maximum supply current minimizes power consumption and heat generation.

Maximum Output Current: 5 A

High maximum output current capability allows for driving power-hungry loads.

Technology: HYBRID

Hybrid technology combines the benefits of different technologies for optimized performance and efficiency.

Terminal Form: THROUGH-HOLE

Through-hole terminals facilitate easy and secure soldering for reliable connections.

Maximum Supply Voltage (Vsup): 16.5 V

High maximum supply voltage tolerance ensures robustness and protection against voltage spikes.

Technical Specifications

Motion Control ICs FNF50560TD2 attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-XDMA-T20

Length:

37 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Output Current:

5 A

Package Body Material:

UNSPECIFIED

Package Code:

DMA

Package Equivalence Code:

MODULE,20LEAD,1.0

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

6 mm

Maximum Supply Current (Isup):

2.5 mA

Maximum Supply Voltage (Vsup):

16.5 V

Minimum Supply Voltage (Vsup):

14 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Technology:

HYBRID

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Width (mm):

21 mm

Trade Compliance

FNF50560TD2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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