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FNF50560TD3

Onsemi

FNF50560TD3 by Onsemi

FNF50560TD3 by Onsemi is a Motion Control IC with 20 terminals, operating voltage range of 14-16.5V, and max output current of 5A. Ideal for AC motor control applications due to its compact size (37x21x6mm) and low supply current (2.5mA).

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,474 parts In-Stock

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1,474

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Digiode

USA . 1,335 parts In-Stock

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1,335

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Distributors (Availability)

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Native Components

USA . 750 parts In-Stock

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$1.900

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750

$1.900

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Northwest PG Solutions

USA . 622 parts In-Stock

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$2.090

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622

$2.090

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Problanco Electronics

Mexico . 7,275 parts In-Stock

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7,275

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TANS Electronics

Latvia . 6,780 parts In-Stock

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6,780

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SupplyDigital Components

Austria . 2,354 parts In-Stock

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2,354

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Kulean Microsystems

USA . 1,603 parts In-Stock

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1,603

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Corphita

USA . 1,492 parts In-Stock

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Corohmni

South Africa . 493 parts In-Stock

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493

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UHIMA Technologies

Türkiye . 330 parts In-Stock

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Overview

Unlock the power of precision control with the FNF50560TD3 motion control IC by Onsemi. Designed for seamless integration and exceptional performance, this AC motor controller offers unparalleled reliability and efficiency in a compact rectangular package. Whether you're automating machinery or optimizing robotics, this versatile IC provides the perfect solution for your motion control needs. Trust in Onsemi's reputation for quality and innovation, and experience the value and benefits that the FNF50560TD3 brings to your projects.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into various electronic devices or systems.

Nominal Supply Voltage (Vsup): 15 V

Optimal supply voltage for efficient performance of the motion control IC.

No. of Terminals: 20

Sufficient number of terminals for connection to other components or devices.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

Microelectronic assembly style offers compact size and efficient performance.

Terminal Position: DUAL

Dual terminal position provides flexibility in wiring and connection options.

Maximum Seated Height: 6 mm

Low seated height allows for space-saving installation in compact devices.

Width (mm): 21 mm

Narrow width makes it suitable for applications with space constraints.

Other IC type: AC MOTOR CONTROLLER

Specialized IC type designed for efficient control of AC motors.

Minimum Supply Voltage (Vsup): 14 V

Allows for operation at lower voltage levels, providing flexibility in power source requirements.

Length: 37 mm

Moderate length for versatility in installation and mounting options.

Maximum Supply Current (Isup): 2.5 mA

Low supply current for energy-efficient operation.

Maximum Output Current: 5 A

High output current capability for driving motors or other high-current devices.

Technology: HYBRID

Hybrid technology offers a balance of performance and efficiency.

Terminal Form: THROUGH-HOLE

Through-hole terminals for secure and reliable connection to PCBs or other components.

Maximum Supply Voltage (Vsup): 16.5 V

Safe maximum supply voltage level for stable operation and protection against overvoltage.

Technical Specifications

Motion Control ICs FNF50560TD3 attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-XDMA-T20

Length:

37 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Output Current:

5 A

Package Body Material:

UNSPECIFIED

Package Code:

DMA

Package Equivalence Code:

MODULE,20LEAD,1.0

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

6 mm

Maximum Supply Current (Isup):

2.5 mA

Maximum Supply Voltage (Vsup):

16.5 V

Minimum Supply Voltage (Vsup):

14 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Technology:

HYBRID

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Width (mm):

21 mm

Trade Compliance

FNF50560TD3 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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