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FNB81060T

Onsemi

FNB81060T by Onsemi

FNB81060T by Onsemi is a Motion Control IC with 25 terminals, Vsup range of 14-16.5V, and max output current of 10A. Ideal for automotive applications due to its temp grade of -40 to 150 °C, AC motor control capability, and flange mount package style.

Median Price

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2

In-Stock Inventory

1k+

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Digiode

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Northwest PG Solutions

USA . 463 parts In-Stock

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TANS Electronics

Latvia . 6,530 parts In-Stock

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SupplyDigital Components

Austria . 3,294 parts In-Stock

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Corphita

USA . 2,398 parts In-Stock

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Problanco Electronics

Mexico . 1,262 parts In-Stock

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UHIMA Technologies

Türkiye . 400 parts In-Stock

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Native Components

USA . 239 parts In-Stock

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Kulean Microsystems

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Overview

Unleash the power of precision and reliability with the FNB81060T by Onsemi. As a leader in motion control ICs, Onsemi delivers unmatched quality and performance for a wide range of applications. Whether you're looking to optimize your automotive systems or enhance your industrial machinery, this AC motor controller offers unparalleled value and benefits. With a maximum output current of 10 A and a temperature grade suitable for automotive use, the FNB81060T is the ultimate solution for all your motion control needs. Elevate your projects with Onsemi's cutting-edge technology and experience the difference firsthand.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular package shape allows for easy placement on circuit boards and efficient use of space.

Nominal Supply Voltage (Vsup): 15 V

15V supply voltage ensures stable and reliable operation of the IC.

No. of Terminals: 25

Having 25 terminals provides flexibility in connecting to various components and peripherals.

Package Style (Meter): FLANG MOUNT

Flange mount package style facilitates secure mounting in systems and prevents damage during operation.

Maximum Operating Temperature: 150 °C

High maximum operating temperature of 150 °C ensures the IC can withstand demanding and harsh environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40 °C allows for reliable operation in extreme cold conditions.

Terminal Position: DUAL

Dual terminal position enables easy and secure connections for enhanced performance and reliability.

Other IC type: AC MOTOR CONTROLLER

Being an AC motor controller allows for efficient control and management of AC motors, making it suitable for various applications.

Minimum Supply Voltage (Vsup): 14 V

A minimum supply voltage of 14V ensures that the IC can operate within a wide voltage range for versatility.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, the IC meets industry standards for reliability and performance in automotive systems.

Maximum Output Current: 10 A

High maximum output current of 10A allows for driving motors and other devices with sufficient power.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides strong and reliable connections for long-term use in various applications.

Maximum Supply Voltage (Vsup): 16.5 V

A maximum supply voltage of 16.5V ensures the IC can handle higher voltage inputs for versatility and robustness.

Technical Specifications

Motion Control ICs FNB81060T attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-XDFM-T25

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

10 A

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

FLANG MOUNT

Maximum Supply Voltage (Vsup):

16.5 V

Minimum Supply Voltage (Vsup):

14 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Trade Compliance

FNB81060T Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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