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FNB80460T

Onsemi

FNB80460T by Onsemi

FNB80460T by Onsemi is a Motion Control IC with 25 terminals, operating at 14-16.5V. It features a max output current of 20A and uses HVCMOS technology. Ideal for AC motor control applications due to its compact MICROELECTRONIC ASSEMBLY package measuring 18mm x 32mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,148 parts In-Stock

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Digiode

USA . 165 parts In-Stock

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Problanco Electronics

Mexico . 5,576 parts In-Stock

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Kulean Microsystems

USA . 5,228 parts In-Stock

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TANS Electronics

Latvia . 4,571 parts In-Stock

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Northwest PG Solutions

USA . 1,509 parts In-Stock

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Corphita

USA . 1,256 parts In-Stock

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SupplyDigital Components

Austria . 1,155 parts In-Stock

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UHIMA Technologies

Türkiye . 867 parts In-Stock

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Native Components

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Corohmni

South Africa . 216 parts In-Stock

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Overview

Unleash the power of precision and efficiency with the FNB80460T by Onsemi. As a leader in motion control ICs, Onsemi delivers unrivaled quality and reliability in every product. The FNB80460T is the perfect solution for applications requiring precise AC motor control. With a nominal supply voltage of 15V and a maximum output current of 20A, this compact microelectronic assembly offers exceptional value and performance. Elevate your projects with the FNB80460T and experience the superior benefits it brings to your applications.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient PCB layout and placement, making it easier to integrate into a design.

Nominal Supply Voltage (Vsup): 15 V

Operating within a nominal supply voltage of 15 V provides a good balance between performance and power efficiency for various motion control applications.

No. of Terminals: 25

Having 25 terminals offers flexibility in connecting various components and peripherals, allowing for a versatile implementation in different systems.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

Microelectronic assembly package style ensures compact size and high reliability, suitable for space-constrained environments and critical applications.

Width (mm): 18 mm

With a width of 18 mm, this motion control IC can fit into compact spaces and slim designs without sacrificing functionality.

Other IC type: AC MOTOR CONTROLLER

Being an AC motor controller, this IC can efficiently control and drive AC motors for various motion control applications, providing precise and reliable operation.

Minimum Supply Voltage (Vsup): 14 V

Operating within a minimum supply voltage of 14 V ensures compatibility with a wide range of power sources, making it versatile for different scenarios.

Length: 32 mm

A length of 32 mm strikes a balance between compactness and functionality, making it suitable for applications where space is limited.

Maximum Supply Current (Isup): 2.2 mA

With a low maximum supply current of 2.2 mA, this IC is energy-efficient and helps reduce power consumption, making it cost-effective in the long run.

Maximum Output Current: 20 A

Capable of delivering a maximum output current of 20 A, this IC can drive high-power loads with ease, making it suitable for demanding motion control tasks.

Technology: HVCMOS

Utilizing HVCMOS technology allows for high voltage operation with low power consumption, ensuring reliable performance and efficiency in motion control applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections and ease of soldering, enhancing the durability and reliability of the IC in harsh environments.

Maximum Supply Voltage (Vsup): 16.5 V

Operating within a maximum supply voltage of 16.5 V ensures safety and protection against overvoltage conditions, enhancing the longevity of the IC and connected components.

Technical Specifications

Motion Control ICs FNB80460T attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-XXMA-T25

Length:

32 mm

No. of Functions:

1

No. of Terminals:

25

Maximum Output Current:

20 A

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Supply Current (Isup):

2.2 mA

Maximum Supply Voltage (Vsup):

16.5 V

Minimum Supply Voltage (Vsup):

14 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Technology:

HVCMOS

Terminal Form:

THROUGH-HOLE

Terminal Position:

UNSPECIFIED

Width (mm):

18 mm

Trade Compliance

FNB80460T Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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