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FNB80560T

Onsemi

FNB80560T by Onsemi

FNB80560T by Onsemi is a Motion Control IC with 25 terminals, operating voltage range of 14-16.5V, and max output current of 5A. Ideal for automotive applications due to its temp range of -40 to 150 °C and AC motor control capabilities in a rectangular package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,786 parts In-Stock

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Vyrian

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Native Components

USA . 691 parts In-Stock

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$8.520

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Northwest PG Solutions

USA . 2,323 parts In-Stock

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$8.435

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TANS Electronics

Latvia . 6,716 parts In-Stock

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SupplyDigital Components

Austria . 5,076 parts In-Stock

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Kulean Microsystems

USA . 1,540 parts In-Stock

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Problanco Electronics

Mexico . 1,186 parts In-Stock

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Corphita

USA . 754 parts In-Stock

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UHIMA Technologies

Türkiye . 407 parts In-Stock

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Corohmni

South Africa . 293 parts In-Stock

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Overview

Experience unmatched quality and reliability with the FNB80560T by Onsemi, a leading manufacturer in motion control ICs. This innovative product offers unparalleled performance and efficiency, making it ideal for a wide range of applications. From automotive to industrial settings, this AC motor controller provides the value and benefits that customers need, with a maximum output current of 5A and a temperature grade suitable for automotive use. Trust Onsemi to deliver cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into various electronic systems and circuit boards.

Nominal Supply Voltage (Vsup): 15 V

The nominal supply voltage of 15V ensures compatibility with a wide range of power sources, making it versatile for different applications.

No. of Terminals: 25

With 25 terminals, this motion control IC offers ample connectivity options for interfacing with other components in a system.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for secure and stable mounting in various industrial and automotive environments.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150 °C ensures reliable performance even in demanding operating conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows for operation in cold environments without compromising performance.

Terminal Position: DUAL

The dual terminal position provides flexibility in connecting the motion control IC to external devices for seamless integration.

Other IC type: AC MOTOR CONTROLLER

Being an AC motor controller type, this IC is specifically designed for controlling AC motors, making it a suitable choice for motor control applications.

Minimum Supply Voltage (Vsup): 14 V

The minimum supply voltage of 14V ensures stable operation even at lower power input levels.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this motion control IC meets the industry standards and requirements for reliability and performance in vehicles.

Maximum Output Current: 5 A

With a maximum output current of 5A, this IC can effectively drive motors with high power requirements.

Terminal Form: THROUGH-HOLE

The through-hole terminal form allows for easy soldering and secure connection to circuit boards, ensuring reliable operation.

Maximum Supply Voltage (Vsup): 16.5 V

The maximum supply voltage of 16.5V provides a safety margin for power input, protecting the IC from voltage spikes and fluctuations.

Technical Specifications

Motion Control ICs FNB80560T attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-XDFM-T25

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

5 A

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

FLANG MOUNT

Maximum Supply Voltage (Vsup):

16.5 V

Minimum Supply Voltage (Vsup):

14 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Trade Compliance

FNB80560T Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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