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FNB81060T1

Onsemi

FNB81060T1 by Onsemi

FNB81060T1 by Onsemi is a Motion Control IC with 25 terminals, operating voltage range of 14-16.5V, and max output current of 10A. Ideal for automotive applications due to its temp range of -40 to 150 °C and AC motor controller type.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 828 parts In-Stock

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Vyrian

USA . 545 parts In-Stock

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Kulean Microsystems

USA . 3,228 parts In-Stock

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Corphita

USA . 2,230 parts In-Stock

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Northwest PG Solutions

USA . 1,858 parts In-Stock

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$3.778

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$3.778

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TANS Electronics

Latvia . 1,555 parts In-Stock

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Problanco Electronics

Mexico . 1,282 parts In-Stock

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SupplyDigital Components

Austria . 708 parts In-Stock

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UHIMA Technologies

Türkiye . 571 parts In-Stock

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Native Components

USA . 249 parts In-Stock

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Corohmni

South Africa . 212 parts In-Stock

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Overview

Enhance your motion control applications with the FNB81060T1 by Onsemi, a top-quality AC motor controller that guarantees precise and efficient performance. Manufactured by Onsemi, a trusted name in the industry known for its superior technology and reliability, this product is designed to meet your automotive needs with a wide operating temperature range and high output current capacity. Whether you're looking to optimize your automotive systems or enhance your industrial machinery, the FNB81060T1 offers unmatched value, benefits, and advantages to help you achieve seamless control and maximum productivity.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration into existing systems and PCB layouts.

Nominal Supply Voltage (Vsup): 15 V

Optimal supply voltage ensures reliable and stable operation of the motion control IC.

No. of Terminals: 25

Sufficient number of terminals for versatile connectivity options and flexibility in setup.

Package Style (Meter): FLANG MOUNT

Flange mount package style offers secure mounting and heat dissipation capabilities.

Maximum Operating Temperature: 150 °C

High maximum operating temperature allows for use in harsh environments without risk of overheating.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures ensures reliable performance in varied conditions.

Terminal Position: DUAL

Dual terminal position offers redundancy and increased reliability in connection points.

Other IC type: AC MOTOR CONTROLLER

Specifically designed for controlling AC motors, ensuring efficient and optimized motor operation.

Minimum Supply Voltage (Vsup): 14 V

Low minimum supply voltage allows for operation in systems with limited power availability.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures the motion control IC can withstand the demanding conditions of automotive applications.

Maximum Output Current: 10 A

High maximum output current capability enables control of powerful motors and devices.

Terminal Form: THROUGH-HOLE

Through-hole terminal form simplifies the soldering process and provides secure connections.

Maximum Supply Voltage (Vsup): 16.5 V

Higher maximum supply voltage allows for flexibility in power input options and compatibility with various systems.

Technical Specifications

Motion Control ICs FNB81060T1 attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-XDFM-T25

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

10 A

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

FLANG MOUNT

Maximum Supply Voltage (Vsup):

16.5 V

Minimum Supply Voltage (Vsup):

14 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Trade Compliance

FNB81060T1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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