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FNA51560TD

Onsemi

FNA51560TD by Onsemi

FNA51560TD by Onsemi is a Motion Control IC with 20 terminals, operating at 14-16.5V. It features a max output current of 15A and technology hybrid for AC motor control applications. The rectangular package measures 37x21x6mm in length, width, and height respectively.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,226 parts In-Stock

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Vyrian

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Corphita

USA . 1,702 parts In-Stock

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Problanco Electronics

Mexico . 928 parts In-Stock

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UHIMA Technologies

Türkiye . 851 parts In-Stock

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Native Components

USA . 792 parts In-Stock

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Kulean Microsystems

USA . 750 parts In-Stock

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Northwest PG Solutions

USA . 439 parts In-Stock

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TANS Electronics

Latvia . 192 parts In-Stock

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Corohmni

South Africa . 97 parts In-Stock

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SupplyDigital Components

Austria . 26 parts In-Stock

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Overview

Enhance your motion control applications with the FNA51560TD by Onsemi, a high-quality AC motor controller offering seamless performance and reliability. Manufactured by industry leader Onsemi, this rectangular-shaped IC boasts a nominal supply voltage of 15V and a maximum output current of 15A. With its compact design and dual terminal position, this microelectronic assembly is perfect for a wide range of motion control tasks. Elevate your projects with the FNA51560TD and experience unparalleled value and efficiency in your applications.

Feature Benefit Bullets

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement and mounting in a variety of applications.

Nominal Supply Voltage (Vsup): 15 V

A reliable and stable supply voltage that is commonly used in many electronic systems.

No. of Terminals: 20

Sufficient number of terminals for versatile connectivity options and functionalities.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

Microelectronic assembly ensures a compact and space-saving design for easier integration.

Terminal Position: DUAL

Dual terminal position provides added flexibility in circuit design and layout.

Maximum Seated Height: 6 mm

Low seated height allows for slim and compact device design while still providing high performance.

Width (mm): 21 mm

Moderate width size that can fit into various electronic systems without taking up too much space.

Other IC type: AC MOTOR CONTROLLER

Specifically designed for controlling AC motors, making it ideal for motor control applications.

Minimum Supply Voltage (Vsup): 14 V

A minimum supply voltage of 14 V ensures optimal performance even under lower voltage conditions.

Length: 37 mm

Length of 37 mm provides sufficient space for components and connections while maintaining a compact form factor.

Maximum Supply Current (Isup): 2.5 mA

Low maximum supply current requirement for efficient power usage and reduced heat generation.

Maximum Output Current: 15 A

High maximum output current capability for driving powerful motors and handling heavy loads.

Technology: HYBRID

Hybrid technology combines the benefits of different technologies to provide optimal performance and efficiency.

Terminal Form: THROUGH-HOLE

Through-hole terminal form for easy and secure connections during installation and maintenance.

Maximum Supply Voltage (Vsup): 16.5 V

A maximum supply voltage of 16.5 V ensures compatibility with a wide range of power sources.

Technical Specifications

Motion Control ICs FNA51560TD attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-XDMA-T20

Length:

37 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Output Current:

15 A

Package Body Material:

UNSPECIFIED

Package Code:

DMA

Package Equivalence Code:

MODULE,20LEAD,1.0

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

6 mm

Maximum Supply Current (Isup):

2.5 mA

Maximum Supply Voltage (Vsup):

16.5 V

Minimum Supply Voltage (Vsup):

14 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Technology:

HYBRID

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Width (mm):

21 mm

Trade Compliance

FNA51560TD Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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