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FNA51060TD3

Onsemi

FNA51060TD3 by Onsemi

FNA51060TD3 by Onsemi is a Motion Control IC with 20 terminals, operating voltage range of 14-16.5 V, and max output current of 10 A. This AC Motor Controller in MICROELECTRONIC ASSEMBLY package is ideal for applications requiring precise motor control in compact spaces.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 4,093 parts In-Stock

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Digiode

USA . 1,468 parts In-Stock

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AZTECH Wire

Italy . 493 parts In-Stock

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$9.030

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SupplyDigital Components

Austria . 6,984 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 6,607 parts In-Stock

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TANS Electronics

Latvia . 5,716 parts In-Stock

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Problanco Electronics

Mexico . 4,217 parts In-Stock

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Corphita

USA . 1,036 parts In-Stock

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Kulean Microsystems

USA . 961 parts In-Stock

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UHIMA Technologies

Türkiye . 882 parts In-Stock

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Northwest PG Solutions

USA . 396 parts In-Stock

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Corohmni

South Africa . 383 parts In-Stock

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Native Components

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Overview

Unlock the power of seamless motion control with the FNA51060TD3 by Onsemi. Crafted with precision and expertise, this AC motor controller offers unparalleled performance and reliability in a compact microelectronic assembly package. Ideal for a wide range of applications, this hybrid technology marvel boasts a nominal supply voltage of 15V and a maximum output current of 10A, providing customers with unmatched value and flexibility. Elevate your projects to new heights with the FNA51060TD3 and experience the difference that quality engineering can make.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration into existing systems and compact design.

Nominal Supply Voltage (Vsup): 15 V

15V nominal supply voltage ensures reliable and stable operation of the motion control IC.

No. of Terminals: 20

With 20 terminals, this IC provides flexibility for various connections and functions.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

Microelectronic assembly package style ensures high reliability and performance in demanding applications.

Terminal Position: DUAL

Dual terminal position offers redundancy and flexibility in circuit design.

Maximum Seated Height: 6 mm

Low seated height allows for easy mounting and integration in space-constrained applications.

Width (mm): 21 mm

Compact width of 21mm makes this IC suitable for small form factor designs.

Other IC type: AC MOTOR CONTROLLER

Being an AC motor controller, this IC is specifically designed for motor control applications.

Minimum Supply Voltage (Vsup): 14 V

14V minimum supply voltage ensures compatibility with a wide range of power sources.

Length: 37 mm

37mm length provides a balance between compact size and functionality.

Maximum Supply Current (Isup): 2.5 mA

Low maximum supply current helps in reducing power consumption and heat generation.

Maximum Output Current: 10 A

10A maximum output current allows for driving high-power loads with ease.

Technology: HYBRID

Hybrid technology offers a combination of performance and reliability for motion control applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form enables easy soldering and robust connections.

Maximum Supply Voltage (Vsup): 16.5 V

16.5V maximum supply voltage provides margin for variations in power supply voltage.

Technical Specifications

Motion Control ICs FNA51060TD3 attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-XDMA-T20

Length:

37 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Output Current:

10 A

Package Body Material:

UNSPECIFIED

Package Code:

DMA

Package Equivalence Code:

MODULE,20LEAD,1.0

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

6 mm

Maximum Supply Current (Isup):

2.5 mA

Maximum Supply Voltage (Vsup):

16.5 V

Minimum Supply Voltage (Vsup):

14 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Technology:

HYBRID

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Width (mm):

21 mm

Trade Compliance

FNA51060TD3 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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